Boxed Processor Specifications
7
Boxed Processor Specifications
The Intel Pentium 4 processor will also be offered as an Intel boxed processor. Intel
boxed processors are intended for system integrators who build systems from
baseboards and standard components. The boxed Pentium 4 processor will be supplied
with a cooling solution. This chapter documents baseboard and system requirements
for the cooling solution that will be supplied with the boxed Pentium 4 processor. This
chapter is particularly important for OEMs that manufacture baseboards for system
integrators. Unless otherwise noted, all figures in this chapter are dimensioned in
millimeters and inches [in brackets]. Figure 17 shows a mechanical representation of a
boxed Pentium 4 processor.
Note:
Drawings in this section reflect only the specifications on the Intel boxed processor
product. These dimensions should not be used as a generic keep-out zone for all
cooling solutions. It is the system designers’ responsibility to consider their proprietary
cooling solution when designing to the required keep-out zone on their system
platforms and chassis. Refer to the appropriate processor Thermal and Mechanical
Design Guidelines (see Section 1.2) for further guidance.
Figure 17.
Mechanical Representation of the Boxed Processor
NOTE: The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.
7.1
Mechanical Specifications
7.1.1
Boxed Processor Cooling Solution Dimensions
This section documents the mechanical specifications of the boxed Pentium 4 processor.
The boxed processor will be shipped with an unattached fan heatsink. Figure 17 shows
a mechanical representation of the boxed Pentium 4 processor.
Clearance is required around the fan heatsink to ensure unimpeded airflow for proper
cooling. The physical space requirements and dimensions for the boxed processor with
assembled fan heatsink are shown in Figure 18 (Side View), and Figure 19 (Top View).
The airspace requirements for the boxed processor fan heatsink must also be
incorporated into new baseboard and system designs. Airspace requirements are
shown in Figure 23 and Figure 24. Note that some figures have centerlines shown
(marked with alphabetic designations) to clarify relative dimensioning.
Datasheet
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INTEL [ INTEL ]
