Package Mechanical Specifications
3.5
Package Insertion Specifications
The Pentium 4 processor in the 775-land package can be inserted into and removed from a
LGA775 socket 15 times. The socket should meet the LGA775 requirements detailed in the
LGA775 Socket Mechanical Design Guide.
3.6
3.7
Processor Mass Specification
The typical mass of the Pentium 4 processor in the 775-land package is 21.5 g [0.76 oz]. This mass
[weight] includes all the components that are included in the package.
Processor Materials
Table 3-3 lists some of the package components and associated materials.
Table 3-3. Processor Materials
Component
Material
Integrated Heat Spreader (IHS)
Substrate
Nickel Plated Copper
Fiber Reinforced Resin
Gold Plated Copper
Substrate Lands
3.8
Processor Markings
Figure 3-5 and Figure 3-6 show the topside markings on the processor. These diagrams aid in the
identification of the Pentium 4 processor in the 775-land package.
Figure 3-5. Processor Top-Side Marking Example
Frequency/L2Cache/Bus/
775_VR_CONFIG_04x
m
‘04
©
INTEL
®
Pentium 4
S-Spec/CountryofAssy
3.60GHz/1M/800/04B
SLxxx [COO]
FPO
[FPO]
UniqueUnit
Identifier
2-DMatrixMark
ATPO Serial#
ATPO
S/N
40
Datasheet
INTEL [ INTEL ]
