5000 参数 Datasheet PDF下载

型号：	5000
PDF下载：	下载PDF文件查看货源
内容描述：	双核英特尔®至强®处理器 [Dual-Core Intel Xeon Processor]
分类和应用：
文件页数/大小：	104 页 / 3687 K
品牌：	INTEL [ INTEL CORPORATION ]

Contents

Introduction................................................................................................................. 9

1.1

Terminology ..................................................................................................... 11

1.2

State of Data .................................................................................................... 12

1.3

References ....................................................................................................... 12

Electrical Specifications ............................................................................................... 15

2.1

Front Side Bus and GTLREF ................................................................................ 15

2.2

Power and Ground Lands.................................................................................... 15

2.3

Decoupling Guidelines ........................................................................................ 16

2.3.1 VCC Decoupling...................................................................................... 16

2.3.2 VTT Decoupling ...................................................................................... 16

2.3.3 Front Side Bus AGTL+ Decoupling ............................................................ 16

2.4

Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ....................................... 16

2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0]) .................................. 17

2.4.2 Phase Lock Loop (PLL) and Filter .............................................................. 18

2.5

Voltage Identification (VID) ................................................................................ 19

2.6

Reserved or Unused Signals................................................................................ 21

2.7

Front Side Bus Signal Groups .............................................................................. 21

2.8

GTL+ Asynchronous and AGTL+ Asynchronous Signals ........................................... 23

2.9

Test Access Port (TAP) Connection....................................................................... 23

2.10 Mixing Processors.............................................................................................. 24

2.11 Absolute Maximum and Minimum Ratings ............................................................. 24

2.12 Processor DC Specifications ................................................................................ 25

2.12.1 VCC Overshoot Specification .................................................................... 31

2.12.2 Die Voltage Validation ............................................................................. 32

Mechanical Specifications............................................................................................. 33

3.1

Package Mechanical Drawings ............................................................................. 33

3.2

Processor Component Keepout Zones................................................................... 37

3.3

Package Loading Specifications ........................................................................... 37

3.4

Package Handling Guidelines............................................................................... 38

3.5

Package Insertion Specifications.......................................................................... 38

3.6

Processor Mass Specifications ............................................................................. 38

3.7

Processor Materials............................................................................................ 38

3.8

Processor Markings............................................................................................ 39

3.9

Processor Land Coordinates ................................................................................ 40

Land Listing ............................................................................................................... 43

4.1

Dual-Core Intel Xeon Processor 5000 Series Land Assignments ............................... 43

4.1.1 Land Listing by Land Name ...................................................................... 43

4.1.2 Land Listing by Land Number ................................................................... 52

Signal Definitions ...................................................................................................... 61

5.1

Signal Definitions .............................................................................................. 61

Thermal Specifications ................................................................................................ 69

6.1

Package Thermal Specifications ........................................................................... 69

6.1.1 Thermal Specifications ............................................................................ 69

6.1.2 Thermal Metrology ................................................................................. 75

6.2

Processor Thermal Features ................................................................................ 77

6.2.1 Thermal Monitor..................................................................................... 77

6.2.2 On-Demand Mode .................................................................................. 77

6.2.3 PROCHOT# Signal .................................................................................. 78

6.2.4 FORCEPR# Signal................................................................................... 78

6.2.5 THERMTRIP# Signal ............................................................................... 78

Dual-Core Intel® Xeon® Processor 5000 Series Datasheet

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