Electrical Specifications
Note:
1.
The MS_ID[1:0] signals are provided to indicate the Market Segment for the processor and may be used
for future processor compatibility or for keying. System management software may utilize these signals to
identify the processor installed.
2.
These signals are not connected to the processor die.
3.
A logic 0 is achieved by pulling the signal to ground on the package.
4.
A logic 1 is achieved by leaving the signal as a no connect on the package.
2.6
Reserved or Unused Signals
All Reserved signals must remain unconnected. Connection of these signals to V
CC
, V
TT
,
V
SS
, or to any other signal (including each other) can result in component malfunction
or incompatibility with future processors. See
for a land
listing of the processor and the location of all Reserved signals.
For reliable operation, always connect unused inputs or bidirectional signals to an
appropriate signal level. Unused active high inputs, should be connected through a
resistor to ground (V
SS
). Unused outputs can be left unconnected; however, this may
interfere with some TAP functions, complicate debug probing, and prevent boundary
scan testing. A resistor must be used when tying bidirectional signals to power or
ground. When tying any signal to power or ground, a resistor will also allow for system
testability. Resistor values should be within ± 20% of the impedance of the baseboard
trace for FSB signals. For unused AGTL+ input or I/O signals, use pull-up resistors of
the same value as the on-die termination resistors (R
TT
).
TAP, Asynchronous GTL+ inputs, and Asynchronous GTL+ outputs do not include on-die
termination. Inputs and utilized outputs must be terminated on the baseboard. Unused
outputs may be terminated on the baseboard or left unconnected. Note that leaving
unused outputs unterminated may interfere with some TAP functions, complicate debug
probing, and prevent boundary scan testing. Signal termination for these signal types
is discussed in the appropriate platform design guidelines.
The TESTHI signals must be tied to the processor V
TT
using a matched resistor, where a
matched resistor has a resistance value within +/-20% of the impedance of the board
transmission line traces. For example, if the trace impedance is 50
Ω
then a value
,
between 40
Ω
and 60
Ω
is required.
The TESTHI signals may use individual pull-up resistors or be grouped together as
detailed below. A matched resistor must be used for each group:
• TESTHI[1:0] - can be grouped together with a single pull-up to V
TT
• TESTHI[7:2] - can be grouped together with a single pull-up to V
TT
• TESTHI8 – cannot be grouped with other TESTHI signals
• TESTHI9 – cannot be grouped with other TESTHI signals
• TESTHI10 – cannot be grouped with other TESTHI signals
• TESTHI11 – cannot be grouped with other TESTHI signals
2.7
Front Side Bus Signal Groups
The FSB signals have been combined into groups by buffer type. AGTL+ input signals
have differential input buffers, which use GTLREF as a reference level. In this
document, the term “AGTL+ Input” refers to the AGTL+ input group as well as the
AGTL+ I/O group when receiving. Similarly, “AGTL+ Output” refers to the AGTL+
output group as well as the AGTL+ I/O group when driving. AGTL+ asynchronous
outputs can become active anytime and include an active PMOS pull-up transistor to
assist the during the first clock of a low-to-high voltage transition.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
21
INTEL [ INTEL CORPORATION ]
