Introduction
1.1
Terminology
A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in
the asserted state when driven to a low level. For example, when RESET# is low, a
reset has been requested. Conversely, when NMI is high, a nonmaskable interrupt has
occurred. In the case of signals where the name does not imply an active state but
describes part of a binary sequence (such as
address
or
data),
the ‘#’ symbol implies
that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a hex ‘A’, and
D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).
Commonly used terms are explained here for clarification:
•
Dual-Core Intel
®
Xeon
®
Processor 5000 Series
– Processor in the FC-LGA6
package with two physical processor cores. Dual-Core Intel Xeon processor 5000
series refers to the “Full Power” Dual-Core Intel Xeon Processor 5000 series with
1066 MHz Front Side Bus. For this document, “processor” is used as the generic
term for the “Dual-Core Intel
®
Xeon
®
Processor 5000 series”.
•
Dual-Core Intel
®
Xeon
®
Processor 5063 (MV)
– This is a lower power version
of the Dual-Core Intel Xeon Processor 5000 series. Dual-Core Intel Xeon Processor
5063 (MV) refers to the “Mid Power” Dual-Core Intel Xeon Processor 5000 series.
Unless otherwise noted, the terms “Dual-Core Intel Xeon 5000 series” and
“processor” also refer to the “Dual-Core Intel Xeon Processor 5063”.
•
FC-LGA6 (Flip Chip Land Grid Array) Package
– The Dual-Core Intel Xeon
Processor 5000 series package is a Land Grid Array, consisting of a processor core
mounted on a pinless substrate with 771 lands, and includes an integrated heat
spreader (IHS).
•
FSB (Front Side Bus)
– The electrical interface that connects the processor to the
chipset. Also referred to as the processor front side bus or the front side bus. All
memory and I/O transactions as well as interrupt messages pass between the
processor and chipset over the FSB.
•
Functional Operation
– Refers to the normal operating conditions in which all
processor specifications, including DC, AC, FSB, signal quality, mechanical and
thermal are satisfied.
•
Storage Conditions
– Refers to a non-operational state. The processor may be
installed in a platform, in a tray, or loose. Processors may be sealed in packaging or
exposed to free air. Under these conditions, processor lands should not be
connected to any supply voltages, have any I/Os biased or receive any clocks.
Upon exposure to “free air” (that is, unsealed packaging or a device removed from
packaging material) the processor must be handled in accordance with moisture
sensitivity labeling (MSL) as indicated on the packaging material.
•
Priority Agent
– The priority agent is the host bridge to the processor and is
typically known as the chipset.
•
Symmetric Agent
– A symmetric agent is a processor which shares the same I/O
subsystem and memory array, and runs the same operating system as another
processor in a system. Systems using symmetric agents are known as Symmetric
Multiprocessing (SMP) systems.
•
Integrated Heat Spreader (IHS)
– A component of the processor package used
to enhance the thermal performance of the package. Component thermal solutions
interface with the processor at the IHS surface.
•
Enhanced Intel SpeedStep Technology
– The next generation implementation
of Intel SpeedStep technology which extends power management capabilities of
servers and workstations.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
11
INTEL [ INTEL CORPORATION ]
