Contents
1
Introduction................................................................................................................11
1.1
Terminology.........................................................................................................11
1.1.1 Processor Packaging Terminology.........................................................12
References..........................................................................................................13
1.2
2
Electrical Specifications........................................................................................15
2.1
2.2
2.3
FSB and GTLREF ...............................................................................................15
Power and Ground Pins ......................................................................................15
Decoupling Guidelines ........................................................................................15
2.3.1
VCC Decoupling......................................................................................16
2.3.2 FSB GTL+ Decoupling ...........................................................................16
2.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking....................................16
Voltage Identification...........................................................................................17
2.4.1 Phase Lock Loop (PLL) Power and Filter...............................................18
Reserved, Unused, and TESTHI Pins.................................................................19
FSB Signal Groups..............................................................................................20
Asynchronous GTL+ Signals...............................................................................21
Test Access Port (TAP) Connection....................................................................21
FSB Frequency Select Signals (BSEL[1:0])........................................................22
Absolute Maximum and Minimum Ratings..........................................................22
Processor DC Specifications...............................................................................23
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
2.12
V
CC Overshoot Specification...............................................................................28
2.12.1 Die Voltage Validation............................................................................29
GTL+ FSB Specifications....................................................................................30
2.13
3
Package Mechanical Specifications.................................................................31
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
Package Mechanical Drawing.............................................................................31
Processor Component Keep-Out Zones .............................................................34
Package Loading Specifications .........................................................................34
Package Handling Guidelines .............................................................................35
Package Insertion Specifications ........................................................................35
Processor Mass Specification .............................................................................35
Processor Materials.............................................................................................35
Processor Markings.............................................................................................36
Processor Pinout Coordinates.............................................................................37
4
5
Pin Listing and Signal Descriptions.................................................................39
4.1
4.2
Processor Pin Assignments ................................................................................39
Alphabetical Signals Reference ..........................................................................54
Thermal Specifications and Design Considerations.................................63
5.1
5.2
Processor Thermal Specifications.......................................................................63
5.1.1 Thermal Specifications...........................................................................63
5.1.2 Thermal Metrology .................................................................................64
Processor Thermal Features...............................................................................65
5.2.1 Thermal Monitor .....................................................................................65
5.2.2 On-Demand Mode..................................................................................65
Datasheet
3
INTEL [ INTEL ]
