320 参数 Datasheet PDF下载

型号：	320
PDF下载：	下载PDF文件查看货源
内容描述：	赛扬D处理器 [Celeron D Processor]
分类和应用：
文件页数/大小：	82 页 / 1743 K
品牌：	INTEL [ INTEL CORPORATION ]

Contents

Introduction

................................................................................................................11

1.1

1.2

Terminology.........................................................................................................11

1.1.1 Processor Packaging Terminology.........................................................12

References ..........................................................................................................13

FSB and GTLREF ...............................................................................................15

Power and Ground Pins ......................................................................................15

Decoupling Guidelines ........................................................................................15

2.3.1 V

Decoupling ......................................................................................16

2.3.2 FSB GTL+ Decoupling ...........................................................................16

2.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking....................................16

Voltage Identification ...........................................................................................17

2.4.1 Phase Lock Loop (PLL) Power and Filter...............................................18

Reserved, Unused, and TESTHI Pins.................................................................19

FSB Signal Groups..............................................................................................20

Asynchronous GTL+ Signals...............................................................................21

Test Access Port (TAP) Connection....................................................................21

FSB Frequency Select Signals (BSEL[1:0]) ........................................................22

Absolute Maximum and Minimum Ratings ..........................................................22

Processor DC Specifications...............................................................................23

Overshoot Specification...............................................................................28

2.12.1 Die Voltage Validation ............................................................................29

GTL+ FSB Specifications ....................................................................................30

Package Mechanical Drawing .............................................................................31

Processor Component Keep-Out Zones .............................................................34

Package Loading Specifications .........................................................................34

Package Handling Guidelines .............................................................................35

Package Insertion Specifications ........................................................................35

Processor Mass Specification .............................................................................35

Processor Materials.............................................................................................35

Processor Markings.............................................................................................36

Processor Pinout Coordinates.............................................................................37

Processor Pin Assignments ................................................................................39

Alphabetical Signals Reference ..........................................................................54

Processor Thermal Specifications.......................................................................63

5.1.1 Thermal Specifications ...........................................................................63

5.1.2 Thermal Metrology .................................................................................64

Processor Thermal Features...............................................................................65

5.2.1 Thermal Monitor .....................................................................................65

5.2.2 On-Demand Mode..................................................................................65

Electrical Specifications

........................................................................................15

Package Mechanical Specifications

.................................................................31

Pin Listing and Signal Descriptions

.................................................................39

4.1

4.2

Thermal Specifications and Design Considerations

.................................63

5.1

5.2

Datasheet

IC37:专业IC行业平台

专业IC领域供求交易平台:提供全面的IC Datasheet资料和资讯，Datasheet 1000万数据，IC品牌1000多家。

网站导航 Datasheet资料库电子术语电子百科

服务中心 常见问题委托交易会员服务

关于我们 公司简介联系我们免责申明

产品索引：A B C D E F G H I J K L M N O P Q R S T U V W X Y Z 0 1 2 3 4 5 6 7 8 9

深圳网络警察报警平台公共信息安全网络监察经营性网站备案信息不良信息举报中心工商网监电子标识全国公安机关备案