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316963-002 参数 Datasheet PDF下载

316963-002图片预览
型号: 316963-002
PDF下载: 下载PDF文件 查看货源
内容描述: 支持英特尔赛扬处理器 [Supporting the Intel Celeron processor]
分类和应用:
文件页数/大小: 100 页 / 1346 K
品牌: INTEL [ INTEL ]
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Thermal Specifications and Design Considerations  
5.2.4  
PROCHOT# Signal  
An external signal, PROCHOT# (processor hot), is asserted when the processor core  
temperature has reached its maximum operating temperature. If the Thermal Monitor  
is enabled (note that the Thermal Monitor must be enabled for the processor to be  
operating within specification), the TCC will be active when PROCHOT# is asserted. The  
processor can be configured to generate an interrupt upon the assertion or de-  
assertion of PROCHOT#.  
As an output, PROCHOT# (Processor Hot) will go active when the processor  
temperature monitoring sensor detects that one or both cores has reached its  
maximum safe operating temperature. This indicates that the processor Thermal  
Control Circuit (TCC) has been activated, if enabled. As an input, assertion of  
PROCHOT# by the system will activate the TCC, if enabled, for both cores. The TCC will  
remain active until the system de-asserts PROCHOT#.  
PROCHOT# allows for some protection of various components from over-temperature  
situations. The PROCHOT# signal is bi-directional in that it can either signal when the  
processor (either core) has reached its maximum operating temperature or be driven  
from an external source to activate the TCC. The ability to activate the TCC via  
PROCHOT# can provide a means for thermal protection of system components.  
PROCHOT# can allow VR thermal designs to target maximum sustained current instead  
of maximum current. Systems should still provide proper cooling for the VR, and rely  
on PROCHOT# only as a backup in case of system cooling failure. The system thermal  
design should allow the power delivery circuitry to operate within its temperature  
specification even while the processor is operating at its Thermal Design Power. With a  
properly designed and characterized thermal solution, it is anticipated that PROCHOT#  
would only be asserted for very short periods of time when running the most power  
intensive applications. An under-designed thermal solution that is not able to prevent  
excessive assertion of PROCHOT# in the anticipated ambient environment may cause a  
noticeable performance loss. Refer to the Voltage Regulator-Down (VRD) 11 Design  
Guide For Desktop and Transportable LGA775 Socket for details on implementing the  
bi-directional PROCHOT# feature.  
5.2.5  
THERMTRIP# Signal  
Regardless of whether or not Thermal Monitor or Thermal Monitor 2 is enabled, in the  
event of a catastrophic cooling failure, the processor will automatically shut down when  
the silicon has reached an elevated temperature (refer to the THERMTRIP# definition in  
Table 25). At this point, the FSB signal THERMTRIP# will go active and stay active as  
described in Table 25. THERMTRIP# activation is independent of processor activity and  
does not generate any bus cycles.  
Datasheet  
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