Electrical Specifications
Notes:
1.
2.
3.
For functional operation, all processor electrical, signal quality, mechanical and thermal specifications must
be satisfied.
Overshoot and undershoot voltage guidelines for input, output, and I/O signals are outlined in Section 3.
Excessive overshoot or undershoot on any signal will likely result in permanent damage to the processor.
Storage temperature is applicable to storage conditions only. In this scenario, the processor must not
receive a clock, and no lands can be connected to a voltage bias. Storage within these limits will not affect
the long-term reliability of the device. For functional operation, please refer to the processor case
temperature specifications.
4.
5.
This rating applies to the processor and does not include any tray or packaging.
Failure to adhere to this specification can affect the long term reliability of the processor.
2.12
Processor DC Specifications
The processor DC specifications in this section are defined at the processor
core (pads) unless noted otherwise. See Section 4.1 for the Dual-Core Intel Xeon
Processor 5000 series land listings and Section 5.1 for signal definitions. Voltage and
current specifications are detailed in Table 2-10. For platform planning refer to
Table 2-11, which provides Voltage-Current projections. This same information is
presented graphically in Figure 2-4.
BSEL[2:0] and VID[5:0] signals are specified in Table 2-12. The DC specifications for
the AGTL+ signals are listed in Table 2-13. Legacy signals and Test Access Port (TAP)
signals follow DC specifications similar to GTL+. The DC specifications for the
PWRGOOD input and TAP signal group are listed in Table 2-14 and the Asynchronous
GTL+ signal group is listed in Table 2-15. The VTTPWRGD signal is detailed in
Table 2-16.
Table 2-10 through Table 2-16 list the DC specifications for the processor and are valid
only while meeting specifications for case temperature (TCASE as specified in Table 6-1),
clock frequency, and input voltages. Care should be taken to read all notes
associated with each parameter.
Table 2-10. Voltage and Current Specifications (Sheet 1 of 2)
Notes
1,13
Symbol
VID
Parameter
Min
Typ
Max
Unit
VID range
1.0750
1.3500
V
V
V
V
for Dual-Core Intel Xeon
CC
Processor 5000 series core. FMB
processor.
See Table 2-11 and Figure 2-4
2, 3, 4, 6,
11
CC
V
V
VID step size during a transition
12.5
425
mV
mV
VID_STEP
Total allowable DC load line shift
from VID steps
12
VID_SHIFT
V
FSB termination voltage (DC + AC
specification)
1.140
1.20
1.260
115
V
A
10, 14
TT
I
I
I
I
I
for Dual-Core Intel Xeon
CC
4, 5, 6, 11
CC
Processor 5000 series with multiple
VID (667 MHz)
I
for Dual-Core Intel Xeon
CC
150
115
115
A
A
A
4, 5, 6, 11
4, 5, 6, 11
18
CC
Processor 5000 series with multiple
VID (1066 MHz)
I
for Dual-Core Intel Xeon
CC
CC
Processor 5063 (MV) with multiple
VID
I
for Dual-Core Intel Xeon
CC_RESET
CC_RESET
Processor 5000 series with multiple
VID (667 MHz)
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
25
INTEL [ INTEL ]
