Boxed Processor Specifications
The fan power header on the baseboard must be positioned to allow the fan heat sink
power cable to reach it. The fan power header identification and location must be
documented in the suppliers platform documentation, or on the baseboard itself. The
baseboard fan power header should be positioned within 177.8 mm [7 in.] from the
center of the processor socket.
Table 8-1.
Table 8-2.
PWM Fan Frequency Specifications for 4-Pin Active CEK Thermal Solution
Description
Min Frequency
Nominal Frequency
Max Frequency
Unit
PWM Control
21,000
25,000
28,000
Hz
Frequency Range
Fan Specifications for 4-pin Active CEK Thermal Solution
Typ
Steady
Max
Steady
Max
Startup
Description
Min
Unit
+12 V: 12 volt fan power supply
IC: Fan Current Draw
10.8
N/A
2
12
1
12
1.25
2
13.2
1.5
2
V
A
SENSE: SENSE frequency
2
Pulses per fan
revolution
Figure 8-11. Fan Cable Connector Pin Out for 4-Pin Active CEK Thermal Solution
Table 8-3.
Fan Cable Connector Pin Out for 4-Pin Active CEK Thermal Solution
Pin Number
Signal
Color
1
2
3
4
Ground
Black
Yellow
Green
Blue
Power: (+12 V)
Sense: 2 pulses per revolution
Control: 21 KHz-28 KHz
8.3.2
Boxed Processor Cooling Requirements
As previously stated the boxed processor will be available in two product
configurations. Each configuration will require unique design considerations. Meeting
the processor’s temperature specifications is also the function of the thermal design of
the entire system, and ultimately the responsibility of the system integrator. The
processor temperature specifications are found in Chapter 6, “Thermal Specifications”
of this document.
100
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
INTEL [ INTEL ]
