Thermal Specifications
Figure 6-2. Dual-Core Intel Xeon Processor 5000 Series (667 MHz) Thermal Profiles
TCASE_MAX is a thermal solution design point. In actuality, units will not significantly exceed
TCASE_MAX_A due to TCC activation.
70
TCASE_MAX_B@TDP
65
TCASE_MAX_A@TDP
60
Thermal Profile B
Y = 0.260*x + 42.3
55
Thermal Profile A
Y = 0.203*x + 41.7
50
45
40
0
10
20
30
40
50
60
70
80
90
100
Pow er [W]
Notes:
1.
Thermal Profile A is representative of a volumetrically unconstrained platform. Please refer to Table 6-5 for
discrete points that constitute the thermal profile.
Implementation of Thermal Profile A should result in virtually no TCC activation. Furthermore, utilization of
thermal solutions that do not meet processor Thermal Profile A will result in increased probability of TCC
activation and may incur measurable performance loss. (Refer to Section 6.2 for details on TCC activation).
Thermal Profile B is representative of a volumetrically constrained platform. Please refer to Table 6-6 for
discrete points that constitute the thermal profile.
Implementation of Thermal Profile B will result in increased probability of TCC activation and measurable
performance loss. Furthermore, utilization of thermal solutions that do not meet Thermal Profile B do not
meet the processor’s thermal specifications and may result in permanent damage to the processor.
2.
3.
4.
®
®
5.
Refer to the Dual-Core Intel Xeon Processor 5000 Series Thermal/Mechanical Design Guidelines for
system and environmental implementation details.
Table 6-5.
Dual-Core Intel Xeon Processor 5000 Series (667 MHz) Thermal Profile A
Table
Power (W)
T
(° C)
Power (W)
T
(° C)
CASE_MAX
50.0
CASE_MAX
57.9
P_profile_min =40.9
_A
80
85
90
95
45
50
55
60
65
70
75
50.8
59.0
51.9
60.0
52.9
61.0
53.9
54.9
55.9
56.9
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
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INTEL [ INTEL ]
