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300 参数 Datasheet PDF下载

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型号: 300
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内容描述: 赛扬D处理器 [Celeron D Processor]
分类和应用:
文件页数/大小: 95 页 / 2070 K
品牌: INTEL [ INTEL ]
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Thermal Specifications and Design Considerations  
The case temperature is defined at the geometric top center of the processor. Analysis  
indicates that real applications are unlikely to cause the processor to consume  
maximum power dissipation for sustained time periods. Intel recommends that  
complete thermal solution designs target the Thermal Design Power (TDP) indicated in  
Table 26 instead of the maximum processor power consumption. The Thermal Monitor  
feature is designed to protect the processor in the unlikely event that an application  
exceeds the TDP recommendation for a sustained periods of time. For more details on  
the usage of this feature, refer to Section 5.2. In all cases the Thermal Monitor  
Feature must be enabled for the processor to remain within specification.  
Table 26.  
Processor Thermal Specifications for 775_VR_CONFIG_05A Processors  
Thermal  
Processor  
Number  
Core Frequency  
(GHz)  
Minimum  
Design  
Maximum TC (°C)  
Notes  
T
C (°C)  
Power (W)  
1, 2  
1, 2  
1, 2  
356  
352  
347  
3.33  
3.2  
86  
86  
86  
5
5
5
See Table 28 and  
Figure 12  
3.06  
NOTES:  
1. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the  
maximum power that the processor can dissipate.  
2. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP.  
Therefore, the maximum T will vary depending on the TDP of the individual processor. Refer to thermal profile  
C
figure and associated table for the allowed combinations of power and T .  
C
Table 27.  
Processor Thermal Specifications for 775_VR_CONFIG_06 Processors  
Thermal  
Processor  
Number  
Core Frequency  
(GHz)  
Minimum  
Design  
Maximum TC (°C)  
Notes  
T
C (°C)  
Power (W)  
1, 2  
1, 2  
1, 2  
1, 2  
1, 2  
365  
360  
356  
352  
347  
3.66  
3.46  
3.33  
3.2  
65  
65  
65  
65  
65  
5
5
5
5
5
See Table 29 and  
Figure 13  
3.06  
NOTES:  
1.  
Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power  
that the processor can dissipate.  
2.  
This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the max-  
imum T will vary depending on the TDP of the individual processor. Refer to thermal profile figure and associated table for the  
C
allowed combinations of power and T .  
C
76  
Datasheet  
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