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3000 参数 Datasheet PDF下载

3000图片预览
型号: 3000
PDF下载: 下载PDF文件 查看货源
内容描述: 双核英特尔​​®至强®处理器 [Dual-Core Intel Xeon Processor]
分类和应用: 连接器
文件页数/大小: 102 页 / 2420 K
品牌: INTEL [ INTEL ]
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Boxed Processor Specifications  
Figure 7-4. Space Requirements for the Boxed Processor (Overall View)  
Boxed Proc OverallView  
7.1.2  
7.1.3  
Boxed Processor Fan Heatsink Weight  
The boxed processor fan heatsink will not weigh more than 550 grams. See Chapter 5  
and the Dual-Core Intel® Xeon® Processor 3000 Series Thermal and Mechanical Design  
Guidelines for details on the processor weight and heatsink requirements.  
Boxed Processor Retention Mechanism and Heatsink  
Attach Clip Assembly  
The boxed processor thermal solution requires a heatsink attach clip assembly, to  
secure the processor and fan heatsink in the baseboard socket. The boxed processor  
will ship with the heatsink attach clip assembly.  
7.2  
Electrical Requirements  
7.2.1  
Fan Heatsink Power Supply  
The boxed processor's fan heatsink requires a +12 V power supply. A fan power cable  
will be shipped with the boxed processor to draw power from a power header on the  
baseboard. The power cable connector and pinout are shown in Figure 7-5. Baseboards  
must provide a matched power header to support the boxed processor. Table 7-1  
contains specifications for the input and output signals at the fan heatsink connector.  
The fan heatsink outputs a SENSE signal that is an open- collector output that pulses at  
a rate of 2 pulses per fan revolution. A baseboard pull-up resistor provides VOH to  
match the system board-mounted fan speed monitor requirements, if applicable. Use of  
the SENSE signal is optional. If the SENSE signal is not used, pin 3 of the connector  
should be tied to GND.  
The fan heatsink receives a PWM signal from the motherboard from the 4th pin of the  
connector labeled as CONTROL.  
Dual-Core Intel® Xeon® Processor 3000 Series Datasheet  
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