1-Gbit P30 Family
3.0
Package Information
3.1
56-Lead TSOP Package
Figure 1.
TSOP Mechanical Specifications
Z
A
2
See Note 2
See Notes 1 and 3
Pin 1
e
See Detail B
E
Y
D
1
A
1
D
Seating
Plane
See Detail A
A
Detail A
Detail B
C
0
b
L
Table 1.
TSOP Package Dimensions (Sheet 1 of 2)
Millimeters
Nom
Inches
Nom
Product Information
Sym
Min
Max
Min
Max
Package Height
Standoff
A
A1
A2
b
-
-
1.200
-
-
-
0.047
-
0.050
0.965
0.100
0.100
18.200
13.800
-
-
0.002
0.038
0.004
0.004
0.717
0.543
-
-
Package Body Thickness
Lead Width
0.995
0.150
0.150
18.400
14.000
0.500
1.025
0.200
0.200
18.600
14.200
-
0.039
0.006
0.006
0.724
0.551
0.0197
0.040
0.008
0.008
0.732
0.559
-
Lead Thickness
Package Body Length
Package Body Width
Lead Pitch
c
D1
E
e
April 2005
10
Intel StrataFlash® Embedded Memory (P30)
Order Number: 306666, Revision: 001
Datasheet
INTEL [ INTEL ]
