256-Mbit J3 (x8/x16)
3.2
Easy BGA (J3) Package
Figure 4. Intel StrataFlash® Memory (J3) Easy BGA Mechanical Specifications
Ball A1
Corner
Ball A1
Corner
D
S1
1
2
3
4
5
6
7
8
8
7
6
5
4
3
2
1
S2
A
B
C
D
E
F
A
B
C
D
E
F
b
e
E
G
H
G
H
Top View - Ball side down
A1
Bottom View - Ball Side Up
A2
A
Seating
Plane
Y
Note: Drawing not to scale
Table 2. Easy BGA Package Dimensions
Millimeters
Inches
Symbol
Min
Nom
Max
Notes
Min
Nom
Max
Package Height
A
1.200
0.0472
Ball Height
A1
A2
b
0.250
0.0098
Package Body Thickness
Ball (Lead) Width
0.780
0.0307
0.0169
0.3937
0.5118
0.5906
0.0394
64
0.330
0.430
10.000
13.000
15.000
1.000
64
0.530
0.0130
0.3898
0.5079
0.5866
0.0209
0.3976
0.5157
0.5945
Package Body Width (32 Mb, 64 Mb, 128 Mb, 256 Mb)
Package Body Length (32 Mb, 64 Mb, 128 Mb)
Package Body Length (256 Mb)
Pitch
D
9.900
10.100
13.100
15.100
1
1
1
E
12.900
14.900
E
[e]
N
Ball (Lead) Count
Seating Plane Coplanarity
Y
0.100
1.600
3.100
4.100
0.0039
0.0630
0.1220
0.1614
Corner to Ball A1 Distance Along D (32/64/128/256 Mb) S1
1.400
2.900
3.900
1.500
3.000
4.000
1
1
1
0.0551
0.1142
0.1535
0.0591
0.1181
0.1575
Corner to Ball A1 Distance Along E (32/64/128 Mb)
Corner to Ball A1 Distance Along E (256 Mb)
S2
S2
NOTES:
1. For Daisy Chain Evaluation Unit information refer to the Intel Flash Memory Packaging Technology Web page at;
www.intel.com/design/packtech/index.htm
2. For Packaging Shipping Media information see www.intel.com/design/packtech/index.htm
12
Datasheet
INTEL [ INTEL ]
