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28F320C3 参数 Datasheet PDF下载

28F320C3图片预览
型号: 28F320C3
PDF下载: 下载PDF文件 查看货源
内容描述: 高级+引导块闪存( C3 ) [Advanced+ Boot Block Flash Memory (C3)]
分类和应用: 闪存存储内存集成电路
文件页数/大小: 68 页 / 1132 K
品牌: INTEL [ INTEL CORPORATION ]
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Contents
Revision History
Date of
Revision
05/12/98
Version
-001
Original version
48-Lead TSOP package diagram change
µBGA
package diagrams change
32-Mbit ordering information change (Section 6)
CFI Query Structure Output Table Change (Table C2)
CFI Primary-Vendor Specific Extended Query Table Change for Optional
Features and Command Support change (Table C8)
Protection Register Address Change
I
PPD
test conditions clarification (Section 4.3)
µBGA
package top side mark information clarification (Section 6)
Byte-Wide Protection Register Address change
V
IH
Specification change (Section 4.3)
V
IL
Maximum Specification change (Section 4.3)
I
CCS
test conditions clarification (Section 4.3)
Added Command Sequence Error Note (Table 7)
Datasheet renamed from
3 Volt Advanced Boot Block, 8-, 16-, 32-Mbit Flash
Memory Family.
Added t
BHWH
/t
BHEH
and t
QVBL
(Section 4.6)
Programming the Protection Register clarification (Section 3.4.2)
Removed all references to x8 configurations
Removed reference to 40-Lead TSOP from front page
Added Easy BGA package (Section 1.2)
Removed 1.8 V I/O references
Locking Operations Flowchart
changed (Appendix B)
Added t
WHGL
(Section 4.6)
CFI Primary Vendor-Specific Extended Query changed (Appendix C)
Max I
CCD
changed to 25 µA
Table 10, added note indicating V
CC
Max = 3.3 V for 32-Mbit device
Added specifications for 0.18 micron product offerings throughout document
Added 64-Mbit density
Changed references of 32Mbit 80ns devices to 70ns devices to reflect the
faster product offering.
10/12/00
-010
Changed VccMax=3.3V reference to indicate that the affected product is the
0.25µm 32Mbit device.
Minor text edits throughout document.
Added 1.8v I/O operation documentation where applicable
Added TSOP PCN ‘Pin-1’ indicator information
Changed references in 8 x 8 BGA pinout diagrams from ‘GND’ to ‘Vssq’
7/20/01
-011
Added ‘Vssq’ to Pin Descriptions Information
Removed 0.4 µm references in DC characteristics table
Corrected 64Mb package Ordering Information from 48-uBGA to 48-VFBGA
Corrected ‘bottom’ parameter block sizes to on 8Mb device to 8 x 4KWords
Minor text edits throughout document
10/02/01
2/05/02
-012
-013
Added specifications for 0.13 micron product offerings throughout document
Corrected Iccw / Ippw / Icces /Ippes values.
Added mechanicals for 16Mb and 64Mb
Minor text edits throughout document.
Description
07/21/98
-002
10/03/98
-003
12/04/98
12/31/98
02/24/99
-004
-005
-006
06/10/99
-007
03/20/00
04/24/00
-008
-009
Datasheet
5