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253668 参数 Datasheet PDF下载

253668图片预览
型号: 253668
PDF下载: 下载PDF文件 查看货源
内容描述: 双核英特尔​​®至强®处理器 [Dual-Core Intel Xeon Processor]
分类和应用:
文件页数/大小: 104 页 / 3687 K
品牌: INTEL [ INTEL ]
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Boxed Processor Specifications  
8 Boxed Processor Specifications  
8.1  
Introduction  
Intel boxed processors are intended for system integrators who build systems from  
components available through distribution channels. The Dual-Core Intel® Xeon®  
Processor 5000 series will be offered as an Intel boxed processor.  
Intel will offer the Dual-Core Intel Xeon Processor 5000 series boxed processor with  
two heat sink configurations available for each processor frequency: 1U passive/2U  
active combination solution and a 2U passive only solution. The 1U passive/2U active  
combination solution is based on a 1U passive heat sink with a removable fan that will  
be pre-attached at shipping. This heat sink solution is intended to be used as either a  
1U passive heat sink or a 2U+ active heat sink. Although the active combination  
solution with removable fan mechanically fits into a 2U keepout, additional design  
considerations may need to be addressed to provide sufficient airflow to the fan inlet.  
The 1U passive/2U active combination solution in the active fan configuration is  
primarily designed to be used in a pedestal chassis where sufficient air inlet space is  
present and strong side directional airflow is not an issue. The 1U passive/active  
combination solution with the fan removed and the 2U passive thermal solution require  
the use of chassis ducting and are targeted for use in rack mount servers. The  
retention solution used for these products is called the Common Enabling Kit, or CEK.  
The CEK base is compatible with both thermal solutions and uses the same hole  
locations as the Intel® Xeon® processor with 800 MHz FSB.  
The 1U passive/active combination solution will utilize a removable fan with a 4-pin  
pulse width modulated (PWM) T-diode control. Use of a 4-pin PWM T-diode controlled  
active thermal solution helps customers meet acoustic targets in pedestal platforms  
through the motherboards’s ability to directly control the RPM of the processor heat  
sink fan. Please see Section 8.3 for more details. Figure 8-1 through Figure 8-3 are  
representations of the two heat sink solutions.  
Figure 8-1. Boxed Dual-Core Intel Xeon Processor 5000 Series 1U Passive/2U Active  
Combination Heat Sink (With Removable Fan)  
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet  
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