Contents
1
Introduction.................................................................................................................9
1.1
1.2
1.3
Terminology ..................................................................................................... 11
State of Data.................................................................................................... 12
References ....................................................................................................... 12
2
Electrical Specifications ............................................................................................... 15
2.1
2.2
2.3
Front Side Bus and GTLREF ................................................................................ 15
Power and Ground Lands.................................................................................... 15
Decoupling Guidelines........................................................................................ 16
2.3.1 VCC Decoupling...................................................................................... 16
2.3.2 VTT Decoupling...................................................................................... 16
2.3.3 Front Side Bus AGTL+ Decoupling ............................................................ 16
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking....................................... 16
2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0]).................................. 17
2.4.2 Phase Lock Loop (PLL) and Filter .............................................................. 18
Voltage Identification (VID) ................................................................................ 19
Reserved or Unused Signals................................................................................ 21
Front Side Bus Signal Groups.............................................................................. 21
GTL+ Asynchronous and AGTL+ Asynchronous Signals........................................... 23
Test Access Port (TAP) Connection....................................................................... 23
2.4
2.5
2.6
2.7
2.8
2.9
2.10 Mixing Processors.............................................................................................. 24
2.11 Absolute Maximum and Minimum Ratings ............................................................. 24
2.12 Processor DC Specifications ................................................................................ 25
2.12.1 VCC Overshoot Specification.................................................................... 31
2.12.2 Die Voltage Validation............................................................................. 32
3
Mechanical Specifications............................................................................................. 33
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
Package Mechanical Drawings ............................................................................. 33
Processor Component Keepout Zones................................................................... 37
Package Loading Specifications ........................................................................... 37
Package Handling Guidelines............................................................................... 38
Package Insertion Specifications.......................................................................... 38
Processor Mass Specifications ............................................................................. 38
Processor Materials............................................................................................ 38
Processor Markings............................................................................................ 39
Processor Land Coordinates................................................................................ 40
4
Land Listing............................................................................................................... 43
4.1
Dual-Core Intel Xeon Processor 5000 Series Land Assignments ............................... 43
4.1.1 Land Listing by Land Name...................................................................... 43
4.1.2 Land Listing by Land Number................................................................... 52
5
6
Signal Definitions ...................................................................................................... 61
5.1 Signal Definitions .............................................................................................. 61
Thermal Specifications ................................................................................................ 69
6.1
Package Thermal Specifications........................................................................... 69
6.1.1 Thermal Specifications ............................................................................ 69
6.1.2 Thermal Metrology ................................................................................. 75
Processor Thermal Features................................................................................ 77
6.2.1 Thermal Monitor..................................................................................... 77
6.2.2 On-Demand Mode .................................................................................. 77
6.2.3 PROCHOT# Signal.................................................................................. 78
6.2.4 FORCEPR# Signal................................................................................... 78
6.2.5 THERMTRIP# Signal ............................................................................... 78
6.2
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
3
INTEL [ INTEL ]
