Thermal Specifications and Design Considerations
6.
Thermal Specifications and Design
Considerations
In order to achieve proper cooling of the processor, a thermal solution (e.g., heat spreader, heat
pipe, or other heat transfer system) must make firm contact to the exposed processor die. The
processor die must be clean before the thermal solution is attached or the processor may be
damaged.
Table 38 provides the Thermal Design Power (TDP) dissipation and the minimum and maximum
T temperatures for the Mobile Intel Pentium 4 Processor-M. A thermal solution should be
J
designed to ensure the junction temperature remains within the minimum and maximum T
J
specifications while operating at the Thermal Design Power. Additionally, a secondary failsafe
mechanism in hardware would be provided to shutdown the processor under catastrophic thermal
conditions, as described in Section 2.4.3. TDP is a thermal design power specification based on the
worst case power dissipation of the processor while executing publicly available software under
normal operating conditions at nominal voltages. Contact your Intel Field Sales Representative for
further information.
Table 38. Power Specifications for the Mobile Intel Pentium 4 Processor-M
Symbol
Parameter
Min
Typ
Max
Unit
Notes
Thermal Design Power at
2.6 GHz & 1.3 V
2.5 GHz & 1.3 V
2.4 GHz & 1.3 V
2.2 GHz & 1.3 V
2.0 GHz & 1.3 V
1.9 GHz & 1.3 V
1.8 GHz & 1.3 V
1.7 GHz & 1.3 V
1.6 GHz & 1.3 V
1.5 GHz & 1.3 V
1.4 GHz & 1.3 V
1.2 GHz & 1.2 V
35.0
35.0
35.0
35.0
32.0
32.0
30.0
30.0
30.0
26.9
25.8
20.8
TDP
W
At 100°C, Note 1
Auto Halt/Stop Grant/Sleep
Power at
PAH
PSGNT
PSLP
W
W
At 50°C, Note 2
At 35°C, Note 2
1.3 V (for >2.0 GHz)
1.3 V (for <= 2.0 GHz)
1.2 V
8.0
7.5
5.9
Deep Sleep Power at
PDSLP
1.3 V
1.2 V
5.0
4.2
Deeper Sleep Power at
1.0 V
PDPRSLP
TJ
W
At 35°C, Note 2
Note 3
2.9
Junction Temperature
0
100
°C
NOTES:
1. TDP is defined as the worst case power dissipated by the processor while executing publicly available
software under normal operating conditions at nominal voltages that meet the load line specifications. The
TDP number shown is a specification based on ICC (maximum) at nominal voltages and indirectly tested by
this ICC (maximum) testing. TDP definition is synonymous with the Thermal Design Power (typical)
specification referred to in the previous EMTS. The Intel TDP specification is a recommended design point
Mobile Intel Pentium 4 Processor-M Datasheet
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INTEL [ INTEL ]
