Intel® Celeron® Processor up to 1.10 GHz
Figure 33. Front View Space Requirements for the Boxed Processor in the S.E.P. Package
5.40 (E)
4.74 (D)
2.02 (C)
Table 57. Boxed Processor Fan Heatsink Spatial Dimensions for the S.E.P. Package
Fig. Ref.
Label
Dimensions (Inches)
Min
Typ
Max
A
B
C
D
E
F
Fan Heatsink Depth (see Figure 27)
1.40
Fan Heatsink Height from Motherboard (see Figure 27)
Fan Heatsink Height (see Figure 31)
0.58
2.00
4.80
Fan Heatsink Width (see Figure 31)
Fan Heatsink Base Width (see Figure 31)
Airflow Keepout Zones from end of Fan Heatsink
Airflow Keepout Zones from face of Fan Heatsink
5.4
0.4
0.2
G
6.1.1.1
6.1.1.2
Boxed Processor Heatsink Weight
The heatsink for the boxed Intel Celeron processor in the S.E.P. Package will not weigh more than
225 grams.
Boxed Processor Retention Mechanism
The boxed Intel Celeron processor requires a S.E.P. Package retention mechanism to secure the
processor in the 242-contact slot connector. A S.E.P. Package retention mechanism are provided
with the boxed processor. Motherboards designed for use by system integrators should include a
retention mechanism and appropriate installation instructions.
The boxed Intel Celeron processor does not require additional fan heatsink supports. Fan heatsink
supports are not shipped with the boxed Intel Celeron processor.
Motherboards designed for flexible use by system integrators must still recognize the boxed
Pentium II processor’s fan heatsink clearance requirements, which are described in the Pentium® II
Processor at 233, 266, 300, and 333 MHz Datasheet (Order Number 243335).
112
Datasheet
INTEL [ INTEL ]
