IN74HCT157A
MAXIMUM RATINGS*
Symbol
Parameter
Value
-0.5 to +7.0
-1.5 to VCC +1.5
-0.5 to VCC +0.5
±20
Unit
V
VCC
VIN
VOUT
IIN
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
V
V
mA
mA
mA
mW
IOUT
DC Output Current, per Pin
±25
ICC
PD
DC Supply Current, VCC and GND Pins
±50
750
Power Dissipation in Still Air, Plastic DIP+
SOIC Package+
500
Tstg
TL
Storage Temperature
-65 to +150
°C
°C
Lead Temperature, 1 mm from Case for 10
Seconds
260
(Plastic DIP or SOIC Package)
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
+Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C
SOIC Package: : - 7 mW/°C from 65° to 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Min
4.5
0
Max
5.5
Unit
V
DC Supply Voltage (Referenced to GND)
VIN, VOUT DC Input Voltage, Output Voltage (Referenced to
GND)
VCC
V
TA
tr, tf
Operating Temperature, All Package Types
Input Rise and Fall Time (Figure 1
-55
0
+125
500
°C
ns
This device contains protection circuitry to guard against damage due to high static
voltages or electric fields. However, precautions must be taken to avoid applications of any voltage
higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and
V
OUT should be constrained to the range GND≤(VIN or VOUT)≤VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or
VCC). Unused outputs must be left open.
2
INTEGRAL [ INTEGRAL CORP. ]
