IN74HC123
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
V
VCC
VIN
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
-0.5 to +7.0
-1.5 to VCC +1.5
-0.5 to VCC +0.5
V
VOUT
IIN
V
A, B, CLR
CX, RX
mA
±20
±30
IOUT
ICC
PD
DC Output Current, per Pin
mA
mA
mW
±25
±50
DC Supply Current, VCC and GND Pins
Power Dissipation in Still Air, Plastic DIP+
SOIC Package+
750
500
Tstg
TL
Storage Temperature
-65 to +150
260
°C
°C
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
+Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C
SOIC Package: : - 7 mW/°C from 65° to 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Min
3.0 **
0
Max
6.0
Unit
V
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
Operating Temperature, All Package Types
VIN, VOUT
TA
VCC
+125
V
-55
°C
ns
tr, tf
Input Rise and Fall Time - CLR
(Figure 2)
VCC =2.0 V
0
0
0
1000
500
400
V
V
CC =4.5 V
CC =6.0 V
A or B
-
No
Limit
RX
CX
External Timing Resistor
External Timing Capacitor
VCC <4.5 V
VCC ≥ 4.5 V
10
2.0
1000
1000
kΩ
µF
0
No
Limit
**
The In74HC123 will function at 2.0 V but for optimum pulse width stability, VCC should be above
3.0 V.
This device contains protection circuitry to guard against damage due to high static voltages or electric
fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated
voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range
GND≤(VIN or VOUT)≤VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC).
Unused outputs must be left open.
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