XMC4500
XMC4000 Family
General Device Information
Table 9
Function
VSSA
VDDC
VDDC
VDDC
VDDC
VDDC
VDDC
VDDC
VDDP
VDDP
VDDP
VDDP
VDDP
VDDP
VDDP
VSS
Package Pin Mapping (cont’d)
LQFP-144 LFBGA-144 LQFP-100 Pad Type
Notes
47
M1
34
AN_Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
19
-
12
61
-
42
90
-
64
125
-
86
-
A2
B12
M11
-
-
-
-
-
-
18
11
62
-
43
86
-
60
126
-
87
-
A11
B1
L12
-
-
-
-
-
-
85
59
VSS
-
A1
A12
M12
J12
-
-
VSS
-
-
VSS
-
-
VSSO
VSS
89
63
Exp. Pad
Exp. Pad
Exposed Die Pad
The exposed die pad is
connected internally to
VSS. For proper operation,
it is mandatory to connect
the exposed pad to the
board ground.
For thermal aspects,
please refer to the
Package and Reliability
parameters in the Data
Sheet. Board layout
examples are given in an
application note.
Data Sheet
25
V1.0, 2013-01
Subject to Agreement on the Use of Product Information
INFINEON [ Infineon ]
