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SAK-TC399XP-256F300S BC 参数 Datasheet PDF下载

SAK-TC399XP-256F300S BC图片预览
型号: SAK-TC399XP-256F300S BC
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内容描述: [Infineon releases its second generation AURIX microcontroller in embedded flash 40 nm technology. It comes back with an increase in performance, memory sizes, connectivity and more scalability to address the new automotive trends and challenges. This family has more than 20 products to provide the most scalable portfolio of safety microcontrol­ler. In terms of performance, the highest end product TC39x offers 6 cores running at 300 MHz and up to 6.9 MBytes embedded RAM, and consuming below 2 W. ]
分类和应用:
文件页数/大小: 548 页 / 21256 K
品牌: INFINEON [ Infineon ]
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TC39x BC/BD-Step  
HistoryChanges from Version 1.0 to Version 1.1  
Added parameter NDFDC  
Added parameter NUCBD  
Added parameter tVER_PAGE_DC  
Added parameter tVER_PAGE_DS  
Removed parameter tVER_PAGE_D  
Changed parameter note tRTU  
Removed chapter 'Parameters Specific to the Emulation Part Only'  
Changes in table 'Package Parameters'  
Changed parameter value of RTH_JCB  
Changed parameter values of RTH_JCT  
4.4  
Changes from Version 1.0 to Version 1.1  
Changes in table ‘Platform Feature Overview‘ - changed package types.  
Changes in chapter ‘Pin Position Definition’ added definition of ‘neighbor pads’  
Changes in chapter ‘Legend’ - changed explanation for PD2  
Changes in table ‘Absolute Maximum Ratings’  
Added footnote 5  
Changed description of parameter IIN  
Changes in table ‘Slow 5V GPIO’ - Parameter IOZ- removed note ‘no analog input’  
Changes in table ‘Slow 3.3V GPIO’ - Parameter IOZ- removed note ‘no analog input’  
Changes in chapter ‘High Performance LVDS Pads’- added two notes  
Changes in table ‘LVDS - IEEE Standard LVDS general purpose link (GPL)’ of LVDS pads  
Changed value for parameter Vl  
Changed condition for parameter Vidth  
Added values for parameter Vidth  
Changed condition for parameter Rin  
Changes in table ‘VADC 5V’ - Parameter VAIN - added note to parameter  
Changes in table ‘DSADC 5V’ - added value for parameter IRMS  
Changes in table ‘DSADC 5V’ - Parameter EDGain - added footnote 4  
Changes in table ‘OSC_XTAL’ - Parameter tOSCS - changed footnote 1  
Changes in chapter ‘Power Supply Current’ - Section ‘ADAS power pattern’ - added SPU frequency  
Changes in table ‘Current Consumption’ - Parameter VEVRSB - changed footnote 8  
Changes in table ‘Module Core Current Consumption’ - added Parameter IDDSPU1 and IIDDSPULJ1  
Changes in table ‘Module Core Current Consumption’ - Parameter IDDSPU2 and IIDDSPULJ2 changed footnote 2  
Changes in table ‘Supply ramp’ - added comment for power cycles  
Changed in chapter ‘ETH RGMII Parameters’ - added figures ETH RGMII TX Signal Timing (Delay on  
Destination ((DoD))  
Changed in chapter ‘ETH RGMII Parameters’ - added figures ETH RGMII RX Signal Timing (Delay on Source  
((DoS))  
Changes in table ‘Quality Parmeters’ - Parameter VHBM1 - changed max. limit  
Changes in chapter ‘Package Outline’ - changed package types.  
Data Sheet  
541  
V 1.2, 2021-03  
OPEN MARKET VERSION  
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