DF8MR12W1M1HF_B67
™
EasyPACK module
1 Package
1
Package
Table 1
Insulation coordination
Symbol Note or test condition
Parameter
Values
3.0
Unit
Isolation test voltage
Internal isolation
VISOL
RMS, f = 50 Hz, t = 1 min
kV
basic insulation (class 1, IEC 61140)
Al2O3
> 200
Comparative tracking
index
CTI
RTI
Relative thermal index
(electrical)
housing
140
°C
Table 2
Characteristic values
Symbol Note or test condition
Parameter
Values
Typ.
10
Unit
Min.
Max.
Stray inductance module
LsCE
nH
Module lead resistance,
terminals - chip
RAA'+CC' TH = 25 °C, per switch
3
mΩ
Module lead resistance,
terminals - chip
RCC'+EE' TH = 25 °C, per switch
2
mΩ
Storage temperature
Mounting force per clamp
Weight
Tstg
F
-40
20
125
50
°C
N
g
G
24
Note:
The current under continuous operation is limited to 25 A rms per connector pin.
2
MOSFET
Table 3
Maximum rated values
Parameter
Symbol Note or test condition
Values
1200
50
Unit
Drain-source voltage
VDSS
IDN
Tvj = 25 °C
TH = 65 °C
V
A
A
Implemented drain current
Continuous DC drain
current
IDDC
Tvj = 175 °C, VGS = 18 V
45
Repetitive peak drain
current
IDRM
VGS
VGS
verified by design, tp limited by Tvjmax
100
A
V
V
Gate-source voltage, max.
transient voltage
D < 0.01
-10/23
-7/20
Gate-source voltage, max.
static voltage
Datasheet
3
Revision 0.10
2022-11-21
INFINEON [ Infineon ]
