CYW89820 参数 Datasheet PDF下载

型号：	CYW89820
PDF下载：	下载PDF文件查看货源
内容描述：	[The AIROC™ CYW89820 Automotive Bluetooth® & Bluetooth® LE SoC is a Bluetooth® 5.2 core spec compliant device for automotive and industrial applications. Manufactured using the industry's advanced 40 nm CMOS low-power process, the CYW89820 is a highly integrated device which delivers up to 11.5 dBm transmit output power in LE and BR modes and up to 2.5 dBm in EDR mode, reducing the device footprint and the costs associated with implementing Bluetooth® solutions.]
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文件页数/大小：	53 页 / 735 K
品牌：	INFINEON [ Infineon ]

AIROC™ Bluetooth® system on chip for automotive applications

Specifications

11.4.2

SPI timing

The SPI interface can be clocked up to 12 MHz.

Table 27 and Figure 12 show the timing requirements when operating in SPI mode 0 and 2.

Table 27

SPI mode 0 and 2

Characteristics

Reference

Min

Max

–

½ SCK

–

Unit

Time from master assert SPI_CSN to first clock edge

Setup time for MOSI data lines

Idle time between subsequent SPI transactions

1 SCK

SPI_CSN

SPI_CLK (mode 0)

SPI_CLK (mode 2)

First Bit

Second Bit

Last Bit

SPI_MOSI

SPI_MISO

Not Driven

First Bit

Not Driven

Figure 12

SPI timing, mode 0 and 2

Table 28 and Figure 13 show the timing requirements when operating in SPI mode 1 and 3.

Table 28

SPI Mode 1 and 3

Reference

Characteristics

Min

Max

–

½ SCK ns

–

Unit

Time from master assert SPI_CSN to first clock edge

Setup time for MOSI data lines

Idle time between subsequent SPI transactions

1 SCK

SPI_CSN

SPI_CLK (mode 1)

SPI_CLK (mode 3)

SPI_MOSI

First Bit

Invalid bit

Second Bit

Last Bit

Not Driven

Last Bit

Not Driven

SPI_MISO

Figure 13

SPI timing, mode 1 and 3

Datasheet

002-25826 Rev. *G

2022-09-24

电子百科

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CYW89820 参数 Datasheet PDF下载

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