BSP 742 R
Package and ordering code
all dimensions in mm
Package:
Ordering code:
P-DSO-8-6
Q67060-S7303-A2
Printed circuit board (FR4, 1.5mm thick, one
2
layer 70µm, 6cm active heatsink area ) as
a reference for max. power dissipation P
tot
and thermal
nominal load current I
L(nom)
Published by
Infineon Technologies AG,
St.-Martin-Strasse 53,
D-81669 München
resistance R
thja
© Infineon Technologies AG 2001
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as a guarantee
of characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,
regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your
nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide
(see address list).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the
types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device
or system. Life support devices or systems are intended to be implanted in the human body, or to support
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of the user or other persons may be endangered.
2004-03-16
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