Preliminary data
Thermal Characteristics
Parameter
Characteristics
Thermal resistance, junction - soldering point
SMD version, device on PCB:
@ 6 cm
2
cooling area
1)
; t
@ min. footprint; t
10 sec.
10 sec.
BSO4804
Symbol
min.
R
thJS
R
thJA
-
-
-
Values
typ.
-
-
-
max.
45
110
62.5
Unit
K/W
Electrical Characteristics,
at
T
j
= 25 °C, unless otherwise specified
Parameter
Static Characteristics
Drain-source breakdown voltage
V
GS
=0V,
I
D
=1mA
Gate threshold voltage,
V
GS
=
V
DS
I
D
=30µA
Zero gate voltage drain current
V
DS
=30V,
V
GS
=0V,
T
j
=25°C
V
DS
=30V,
V
GS
=0V,
T
j
=125°C
Gate-source leakage current
V
GS
=20V,
V
DS
=0V
V
GS
=4.5V,
I
D
=6.7A
Drain-source on-state resistance
V
GS
=10V,
I
D
=8A
R
DS(on)
-
17.4
20
1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
Page 2
2001-09-06
Drain-source on-state resistance
Symbol
min.
V
(BR)DSS
V
GS(th)
I
DSS
-
-
I
GSS
R
DS(on)
-
-
30
1.2
Values
typ.
-
1.6
max.
-
2
Unit
V
µA
0.01
10
1
23.8
1
100
100
28.2
nA
m
INFINEON [ INFINEON TECHNOLOGIES AG ]
