2 Lead Metal Package Quartz Crystal, 4.7mm x 11mm
HC49U Series
Pb Free Solder Reflow Profile:
Ts max to TL (Ramp-up Rate)
3ºC / second max
Preheat
Temperature min (Ts min)
Temperature typ (Ts typ)
Temperature max (Ts max)
Time (Ts)
150ºC
175ºC
200ºC
60 to180 seconds
Ramp-up Tate (TL to Tp
3ºC / second max
Time Maintained Above
Temperature (TL)
Time (TL)
217ºC
60 to 150 seconds
Peak Temperature (Tp)
260ºC max for 10 seconds
Time within 5ºC to Peak
Temperature (Tp)
20 to 40 seconds
Ramp-down Rate
Tune 25ºC to Peak Temperature
6ºC / second max
8 minutes max
Units are backward compatible with +240°C reflow processes
Package Information:
MSL = 1
Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal).
Environmental Specifications
Thermal Shock
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS Compliant
JESD22-B102 Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A1
MIL-STD-202, Method 215
Moisture Resistance
``Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
Marking
Line 1: ILSI
Line 2: Frequency
Line 3: Date Code (YWW)
Rev: 12/08/17_B
Page 2 of 2
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www.ilsiamerica.com
Specifications subject to change without notice
ILSI [ ILSI ]
