IDT2308
3.3V ZERO DELAY CLOCK MULTIPLIER
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
PIN CONFIGURATION
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol
V
DD
Rating
Supply Voltage Range
Input Voltage Range (REF)
Input Voltage Range
(except REF)
I
IK
(V
I
< 0)
I
OK
(V
O
< 0 or V
O
> V
DD
)
I
O
(V
O
= 0 to V
DD
)
V
DD
or GND
T
A
= 55°C
(in still air)
(3)
T
STG
Operating
Storage Temperature Range
Commercial Temperature
Range
Industrial Temperature
Range
-40 to +85
°C
–65 to +150
0 to +70
°C
°C
Continuous Current
Maximum Power Dissipation
±100
0.7
mA
W
Input Clamp Current
Terminal Voltage with Respect
to GND (inputs V
IH
2.5, V
IL
2.5)
Continuous Output Current
±50
mA
Max.
–0.5 to +4.6
–0.5 to +5.5
–0.5 to
V
DD
+0.5
–50
±50
mA
mA
Unit
V
V
V
V
I (2)
V
I
REF
CLKA1
CLKA2
V
DD
GND
CLKB1
CLKB2
S2
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
FBK
CLKA4
CLKA3
V
DD
GND
CLKB4
CLKB3
S1
SOIC/ TSSOP
TOP VIEW
Temperature
Operating
Temperature
PIN DESCRIPTION
Pin Number
REF
(1)
CLKA1
(2)
CLKA2
(2)
V
DD
GND
CLKB1
(2)
CLKB2
(2)
S2
(3)
Functional Description
Input Reference Clock, 5 Volt Tolerant Input
Clock Output for Bank A
Clock Output for Bank A
3.3V Supply
Ground
Clock Output for Bank B
Clock Output for Bank B
Select Input, Bit 2
Select Input, Bit 1
Clock Output for Bank B
Clock Output for Bank B
Ground
3.3V Supply
Clock Output for Bank A
Clock Output for Bank A
PLL Feedback Input
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may
cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational sections of this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect reliability.
2. The input and output negative-voltage ratings may be exceeded if the input and output
clamp-current ratings are observed.
3. The maximum package power dissipation is calculated using a junction temperature
of 150
°
C and a board trace length of 750 mils.
APPLICATIONS:
•
•
•
•
•
S1
(3)
CLKB3
(2)
CLKB4
(2)
GND
V
DD
CLKA3
(2)
CLKA4
(2)
FBK
SDRAM
Telecom
Datacom
PC Motherboards/Workstations
Critical Path Delay Designs
NOTES:
1. Weak pull down.
2. Weak pull down on all outputs.
3. Weak pull ups on these inputs.
2
IDT [ INTEGRATED DEVICE TECHNOLOGY ]
