Integrated
Circuit
Systems, Inc.
ICS843-106
106.25MH
Z
, LVCMOS, LVPECL
D
UAL
O
UTPUT
O
SCILLATOR
P
OWER
C
ONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS843-106.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS843-106 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC
= 3.3V + 0.3V = 3.6V, which gives worst case results.
NOTE:
Please refer to Section 3 for details on calculating power dissipated in the load.
•
•
Power (core)
MAX
= V
CC_MAX
* I
EE_MAX
= 3.6V * 116mA =
417.6mW
Power (outputs)
MAX
=
30mW/Loaded Output pair
Total Power
_MAX
(3.465V, with all outputs switching) = 417.6mW + 30mW =
447.6mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of
the device. The maximum recommended junction temperature for HiPerClockS
TM
devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA
* Pd_total + T
A
Tj = Junction Temperature
θ
JA
= Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A
= Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA
must be used.
Assuming a moderate air flow of 1 meter per second and a multi-layer board, the appropriate value is 90.5°C/W per Table 6A
below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.448W * 90.5°C/W = 110.5°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air
flow, and the type of board (single layer or multi-layer).
T
ABLE
6A. T
HERMAL
R
ESISTANCE
θ
JA
FOR
8-
PIN
TSSOP, F
ORCED
C
ONVECTION
θ
JA
by Velocity (Meters per Second)
0
Multi-Layer PCB, JEDEC Standard Test Boards
101.7°C/W
1
90.5°C/W
2.5
89.8°C/W
T
ABLE
6B. T
HERMAL
R
ESISTANCE
θ
JA
FOR
8 L
EAD
SOIC F
ORCED
C
ONVECTION
θ
JA
by Velocity (Linear Feet per Minute)
0
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
153.3°C/W
112.7°C/W
200
128.5°C/W
103.3°C/W
500
115.5°C/W
97.1°C/W
NOTE:
Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
843AG-106
www.icst.com/products/hiperclocks.html
8
REV. A JANUARY 10, 2006
ICS [ INTEGRATED CIRCUIT SYSTEMS ]
