iC-SG85 BLCC SG4C
Infrared LED
ar y
limin
pre
Rev A1, Page 2/5
THERMAL DATA
Item
No.
T01
T02
T03
Symbol
Ta
Ts
Tpk
Parameter
Operating Ambient Temperature Range
Storage Temperature Range
Soldering Temperature
tpk < 5 s, manual soldering;
Not suitable for reflow or vapor phase
soldering.
300
-40
125
Conditions
Min.
-40
-40
Typ.
Max.
125
125
260
°C
°C
°C
Unit
T04
T05
Rthja
Tj
Thermal resistance junction to ambient
Junction Temperature
K/W
°C
THERMAL DERATING CURVE
POWER DISSIPATION [mW]
150
100
50
0
25
50
75
100
125
AMBIENT TEMPERATURE [°C]
Figure 1: Maximum power dissipation with respect to temperature
ELECTRICAL CHARACTERISTICS
Tamb = 25°C, unless otherwise noted
Item
No.
001
002
003
004
005
006
008
Symbol
Parameter
Conditions
Min.
VF
VR
Φ
e
TK(Φ
e
)
λ
p
∆λ
tr, tf
Forward voltage
Reverse voltage
Radiant power
IF = 20 mA
IR = 5 µA
IF = 20 mA
5
2.7
-0.6
840
850
30
12
860
Typ.
1.4
Max.
1.8
V
V
mW
%/K
nm
nm
ns
Unit
Electrical and Optical Characteristics
Temperature coefficient of radiant IF = 20 mA, Tamb = 25°C...125°C
power
Peak wavelength
Spectral half width
Switching time
IF = 20 mA
IF = 10 mA
IF = 100 mA, RL = 50
Ω
Remarks: Measured optical characteristcs may depend on conditions and equipment and thus differ in its given
typical values.
ICHAUS [ IC-HAUS GMBH ]
