iC-PN2656
preliminar y
Rev A4, Page 4/7
PHASED ARRAY NONIUS ENCODER 26-256
ABSOLUTE MAXIMUM RATINGS
These ratings do not imply operating conditions; functional operation is not guaranteed. Beyond these ratings device damage may occur.
Item
No.
Symbol
Parameter
Voltage at VCC
Current in VCC
Pin Voltage, all signal outputs
Pin Current, all signal outputs
ESD Susceptibility, all pins
Junction Temperature
Chip Storage Temperature
HBM, 100 pF discharged through 1.5 kΩ
-40
-40
Conditions
Min.
-0.3
-20
-0.3
-20
Max.
6
20
VCC +
0.3
20
2
150
150
V
mA
V
mA
kV
°C
°C
Unit
G001 VCC
G002 I(VCC)
G003 V()
G004 I()
G005 Vd()
G006 Tj
G007 Ts
THERMAL DATA
Item
No.
T01
Symbol
Ta
Parameter
Conditions
Min.
Operating Ambient Temperature Range package cQFN32 (clear)
package oQFN32 (black)
package oBGA LSH2C
Storage Temperature Range
package cQFN32 (clear)
package oQFN32 (black)
package oBGA LSH2C
package cQFN32 (clear)
tpk < 10 s, convection reflow
MSL 5A (max. floor live 24 h at 30 °C and
60 % RH)
Please refer to customer information file No. 7
for details.
Not suitable for vapour phase soldering.
T04
Tpk
Soldering Peak Temperature
package cQFN32 (black)
tpk < 10 s, convection reflow
MSL 3 (max. floor live 168 h at 30 °C and
60 % RH)
Please refer to customer information file No. 7
for details.
Not suitable for vapour phase soldering.
T05
Tpk
Soldering Peak Temperature
package oQFN32 (black)
package oBGA LSH2C
tpk < 20 s, convection reflow
tpk < 20 s, vapor phase soldering
TOL (time on label) 8 h;
Please refer to customer information file No. 7
for details.
260
230
°C
°C
245*
°C
245
°C
-20
-40
-40
-20
-40
-40
Typ.
Max.
70
110*
125
70
110*
125
°C
°C
°C
°C
°C
°C
Unit
T02
Ts
T03
Tpk
Soldering Peak Temperature
*) Package qualification pending.
All voltages are referenced to ground unless otherwise stated.
All currents into the device pins are positive; all currents out of the device pins are negative.
ICHAUS [ IC-HAUS GMBH ]
