iC-PN2624
PHASED ARRAY NONIUS ENCODER 26-1024
Rev B1, Page 4/7
ABSOLUTE MAXIMUM RATINGS
These ratings do not imply operating conditions; functional operation is not guaranteed. Beyond these ratings device damage may occur.
Item Symbol
No.
Parameter
Conditions
Unit
Min.
-0.3
-20
Max.
6
G001 VCC
G002 I(VCC)
G003 V()
Voltage at VCC
V
mA
V
Current in VCC
20
Pin Voltage, all signal outputs
-0.3
VCC +
0.3
G004 I()
G005 Vd()
G006 Tj
G007 Ts
Pin Current, all signal outputs
ESD Susceptibility, all pins
Junction Temperature
-20
20
2
mA
kV
°C
°C
HBM, 100 pF discharged through 1.5 kΩ
-40
-40
150
150
Chip Storage Temperature
THERMAL DATA
Item Symbol
No.
Parameter
Conditions
Unit
Min. Typ. Max.
T01 Ta
Operating Ambient Temperature Range
package oBGA LSH2C
package oQFN32-N5x5
package oQFN32-5x5*
-40
-40
-40
110
110
110*
°C
°C
°C
(extended temperature range on request)
T02 Ts
Storage Temperature Range
Soldering Peak Temperature
package oBGA LSH2C,
package oQFN32-N5x5, oQFN32-5x5*
-40
-40
110
110*
°C
°C
T03 Tpk
package oBGA LSH2C
tpk < 20 s, convection reflow
tpk < 20 s, vapor phase soldering
245
230
°C
°C
TOL (time on label) 8 h;
Please refer to customer information file No. 7
for details.
T04 Tpk
Soldering Peak Temperature
package oQFN32-N5x5, oQFN32-5x5*
tpk < 20 s, convection reflow
tpk < 20 s, vapor phase soldering
245
230
°C
°C
MSL 5A (max. floor live 24 h at 30 °C and
60 % RH);
Please refer to customer information file No. 7
for details.
*) Package qualification pending.
All voltages are referenced to ground unless otherwise stated.
All currents flowing into the device pins are positive; all currents flowing out of the device pins are negative.