iC-NZ
FAIL-SAFE LASER DIODE DRIVER
Rev B2, Page 4/20
ABSOLUTE MAXIMUM RATINGS
Beyond these values damage may occur; device operation is not guaranteed.
Item
No.
Symbol
Parameter
Supply Voltage VDD Current
Current in VDD
Current in CIx
Current in NSF
Current in SMD
Current in NERR
Current in MDL
Current in RMDx
Current in LENL, LENM, LENH,
REGEN, NEN, ENCAL
Current in LDKx
Current in LDA
Current in RSI
Current in SDIS
Current in VREF
Voltage at RMDH, RVDD, RMDM, NSF,
MDL, ENCAL, SMD, VREF, REGEN,
CIx, LENx, NERR, LDA, RSI, SDIS
Voltage at LDKx
ESD Susceptibility at all pins
Operating Junction Temperature
Storage Temperature Range
HBM, 100 pF discharged through 1.5 kΩ
-40
-40
-0.7
V(LDA) = 0
Conditions
Min.
-0.7
Max.
6
400
5
20
20
20
20
20
20
300
400
20
20
50
6
V
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
V
Unit
G001 VDD
G002 I(VDD)
G003 I(CIx)
G004 I(NSF)
G005 I(SMD)
G006 I(NERR)
G007 I(MDL)
G008 I(RMDx)
G009 I()dig
G010 I(LDKx)
G011 I(LDA)
G012 I(RSI)
G013 I(SDIS)
G014 I(VREF)
G015 V()c
G016 V()h
G017 Vd()
G018 Tj
G019 Ts
-0.7
15
2
150
150
V
kV
°C
°C
THERMAL DATA
Operating Conditions: VDD = 3.5...5.5 V
Item
No.
T01
T02
Symbol
Ta
Rthja
Parameter
Operating Ambient Temperature Range
(extended range on request)
Thermal Resistance Chip/Ambient
surface mounted, thermal pad soldered to ca.
2 cm² heat sink
Conditions
Min.
-20
30
Typ.
Max.
90
40
°C
K/W
Unit
All voltages are referenced to ground unless otherwise stated.
All currents into the device pins are positive; all currents out of the device pins are negative.