iC-MA
ANGULAR HALL SENSOR / ENCODER
Rev B3, Page 3/18
PACKAGES DFN10 according to the JEDEC standard
PIN CONFIGURATION - DFN10 4 mm x 4 mm
PIN FUNCTIONS
No. Name Function
1 NEN Enable Input, low active
2 GND Ground
3 CFG2 Configuration Input 2
1
2
3
4
5
10
9
4 B
5 A
6 D
7 C
Bidirectional Input/Output B
Bidirectional Input/Output A
Bidirectional Input/Output D
Bidirectional Input/Output C
8
iC-MA
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7
8 CFG3 Configuration Input 3
9 VDD +5 V Supply Voltage
10 CFG1 Configuration Input 1
6
The Thermal Pad on the bottom of the package should be connected to Ground (GND) on the PCB.
Orientation of package label ( MA CODE ...) may vary.
PIN CONFIGURATION - Die
PIN FUNCTIONS
2.74 mm x 1.94 mm
No. Name Function
1 NEN Enable Input, low active
2 GND Ground
3 CFG2 Configuration Input 2
9
8
7
4 B
5 A
6 D
7 C
Bidirectional Input/Output B
Bidirectional Input/Output A
Bidirectional Input/Output D
Bidirectional Input/Output C
10
1
6
5
8 CFG3 Configuration Input 3
9 VDD +5 V Supply Voltage
10 CFG1 Configuration Input 1
2
3
4
ICHAUS [ IC-HAUS GMBH ]
