iC-LTA
6-CH. INCREMENTAL OPTO ENCODER ARRAY
Rev B1, Page 7/13
ABSOLUTE MAXIMUM RATINGS
These ratings do not imply operating conditions; functional operation is not guaranteed. Beyond these ratings device damage may occur.
Item Symbol
No.
Parameter
Conditions
Unit
Min.
-0.3
-20
Max.
6
G001 VCC
G002 I(VCC)
G003 V()
Voltage at VCC
Current in VCC
V
mA
V
20
Voltage at Output Pins
PA, NA, PB, NB, PZ, NZ, U, V, W#
-0.3
VCC +
0.3
G004 I()
G005 V()
Current in Output Pins
PA, NA, PB, NB, PZ, NZ, U, V, W#
-20
20
mA
V
Voltage at LED
-0.3
VCC +
0.3
G006 I()
G007 V()
Current in LED
-120
-0.3
20
mA
V
Voltage at TIP, TIN, SEL
VCC +
0.3
G008 I()
G009 Vd()
G010 Tj
G011 Ts
Current in TIP, TIN, SEL
-20
20
2
mA
kV
°C
°C
ESD Susceptibility at all pins
Junction Temperature
HBM, 100 pF discharged through 1.5 kΩ
-40
-40
150
150
Chip Storage Temperature Range
THERMAL DATA
Item Symbol
No.
Parameter
Conditions
Unit
Min. Typ. Max.
T01 Ta
T02 Ts
Operating Ambient Temperature Range package oQFN32-5x5, oBGA LSH2C
-40
-40
110
110
°C
°C
Permissible Storage Temperature
Range
package oQFN32-5x5, oBGA LSH2C
T03 Tpk
Soldering Peak Temperature
package oBGA LSH2C;
tpk < 20 s, convection reflow
tpk < 20 s, vapor phase soldering
245
230
°C
°C
TOL (time on label) 8 h;
Please refer to customer information file No. 7
for details.
T04 Tpk
Soldering Peak Temperature
package oQFN32-5x5;
tpk < 20 s, convection reflow
tpk < 20 s, vapor phase soldering
245
230
°C
°C
MSL 5A (max. floor live 24 h at 30 °C and
60 % RH);
Please refer to customer information file No. 7
for details.
All voltages are referenced to ground unless otherwise stated.
All currents flowing into the device pins are positive; all currents flowing out of the device pins are negative.