iC-DL
3-CHANNEL DIFFERENTIAL LINE DRIVER
Rev B1, Page 7/9
PRINTED CIRCUIT BOARD LAYOUT
The
thermal pad
at the bottom of the package im-
proves thermal dissipation. The board layout has to
be designed so that an appropriate number of copper
vias below the thermal pad area form a good conduc-
tive path to the reverse of the board where a blank cop-
per surface of sufficient size (approx. 2 cm²) carries off
heat. The
thermal pad
is to be soldered to the board
and must be connected to GND.
To smooth the local IC supply VCC and VBx, block-
ing capacitors must be connected directly to these pins
and to GND.
EVALUATION BOARD
iC-DL is in a QFN28 package and comes with a eval-
uation board for test purposes. Figures 5 and 6 show
both the wiring and the top of the evaluation board.
Figure 5: Circuit diagram of the evaluation board
ICHAUS [ IC-HAUS GMBH ]
