Datasheet
DD2.X
PowerPC 750CL Microprocessor
Preliminary
2.2 General Parameters
Table 2-2. 750CL General Parameters
Item
Description
90 nm copper silicon-on-insulator (SOI) technology
Low-K dielectric
8 layer metal wirings
CMOS 10KE
Technology
Die Size
15.92 sq. mm (3.99 × 3.99 mm)
Logic design
Fully static
278-pin flip chip plastic ball grid array (FCPBGA)
21 × 21 mm (1.0 mm pitch)
Package
0.6 mm ball size
Core power supply
I/O power supply
0.95 V nominal to 1.25 V nominal, depending on the part number
1.15 V nominal or 1.8 V nominal
Overview
Version 2.5
December 2, 2008
Page 20 of 70