Specifications
Electrical interface
Transmit signal input differential swing
Transmit signal input differential impedance
Receive signal output differential swing
Receive signal output differential impedance
Control I/O signals
Optical
Data rate
Short wavelength
Long wavelength
Maximum launch power into fiber (avg.)
Minimum launch power into fiber (avg.)
Receiver optical modulation amplitude (OMA)— 1.0625 Gbps
Receiver optical modulation amplitude (OMA)— 2. 25 Gbps
1
Power
Voltage
Current
Short wavelength
50/125 µm Optical Fiber
Distance—1.0625 Gbps
Distance—1.25 Gbps
Distance—2. 25 Gbps
1
62.5/125 µm Optical Fiber
Distance—1.0625 Gbps
Distance—1.2 Gbps
Distance—2. 25 Gbps
1
Long wavelength
9/125 µm Optical Fiber
Distance—1.0625 Gbps
Distance—1.25 Gbps
Distance—2. 50 Gbps
1
Environmental
Operating temperature
Operating humidity
Storage temperature
Physical size
Height
Width
Depth
PTH
9.8 mm
13.5 mm
49.5 mm
2 to 300 m
2 to 275 m
2 to 150 m
2 to 500 m
2 to 550 m
2 to 300 m
+3.3 V +/-5%
200 mA maximum
400 to 2000 mVpp
100 ohms Nominal
600 to 1000 mVpp
100 ohms Nominal
TTL
© Copyright IBM Corporation 2000
All Rights Reserved
Printed in the United States of America 9-00
The following are trademarks of International
Business Machines Corporation in the United States,
or other countries, or both:
IBM
IBM Logo
1.0625 to 2. 25 Gbps
1
850 nm to 860 nm
1310 nm
-4.0 dBm
-10.0 dBm
31 to 2000 µWpp
49 to 2000 µWpp
Other company, product and service names may be
trademarks or service marks of others.
All information contained in this document is subject
to change without notice. The products described in
this document are NOT intended for use in
implantation or other life support applications where
malfunction may result in injury or death to persons.
The information contained in this document does
not affect or change IBM product specifications or
warranties. Nothing in this document shall operate
as an express or implied license or indemnity under
the intellectual property rights of IBM or third parties.
All information contained in this document was
obtained in specific environments, and is presented
as an illustration. The results obtained in other
operating environments may vary.
THE INFORMATION CONTAINED IN THIS DOCU-
MENT IS PROVIDED ON AN “AS IS” BASIS. In no
event will IBM be liable for damages arising directly
or indirectly from any use of the information
contained in this document.
IBM Microelectronics Division
2070 Route 52, Bldg. 330
Hopewell Junction, NY 12533-6351
The IBM home page can be found at
ibm.com.
The IBM Microelectronics Division home page
can be found at
ibm.com/chips.
2 to 10,000 m
2 to 5,000 m
2 to 10,000 m
0° C to 70° C
8% RH to 80% RH
-40° C to 85° C
Hot-pluggable
8.6 mm
13.5 mm
56.5 mm
Form factor
Small form factor, LC connector, 2x5 or 2x6 pin through hole (PTH) and hot-pluggable (SFP)
Laser safety (Class I) and certifications
U.S.
DHHS 21 CFR (J) Conformant and UL
International
IEC 825-1 Conformant and CSA
Reliability
Average failure rate (AFR)
Maximum bit error rate at minimum receiver sensitivity
< 0.01% / khr (50° C)
< 10
-12
*07G522016000*
G522-0160-00
IBM [ IBM ]
