Figure 4-5. PowerPC 970FX Microprocessor Mechanical Package for Reduced-Lead DD3.1 Parts (top and side)
45L5867 (576)
SOLDERBALL
Side View
(2X) (6.15)
(2x) (2.05)
(8X) (1.6)
(2X) (6.15)
(2x) (2.05)
CAPACITOR (8)
0612 CAPACITOR
5
5
6
32R8131
CHIP CARRIER ASM
5
CHIP
2
14
A
A01 CORNER
(CHIP CARRIER)
C4 ENCAPSULANT
7
CAPACITOR
C4 ENCAPSULANT
FILLET
CHIP
A
E
D
2
A
1
0.5+0.05-0.15
Top View
( 9.4 )
( 25 ± 0.2 )
(1.35 MAX)
(1.08 MIN)
B
2
(1.90 MAX)
(1.43 MIN)
(8X) (0.59 MAX)
(8X) (1.94 MAX)
(8X) (2.49 MAX)
Legend
1
2
3
DATUM A is the center plane of feature labeled DATUM A.
DATUM B is the center plane of feature labeled DATUM B.
Unless otherwise specified, the part is symmetrical about center lines defined by DATUMs A and B.
(0.908 MAX)
(0.779 MIN)
Where not otherwise defined, center lines indicated are to be interpreted as a datum framework, established by DATUM
D, A, and B respectively.
4
7
(2.258 MAX)
(1.859 MIN)
This line defines the approximate boundary configuration of encapsulant as dispensed. For underfill requirements, see
IBM Engineering Specification 71X8781 Module Encapsulation Specification.
(2.808 MAX)
(2.209 MIN)
0.15 C
C
SEATING PLANE
IBM [ IBM ]
