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IBM25PPC970FX6UB186ET 参数 Datasheet PDF下载

IBM25PPC970FX6UB186ET图片预览
型号: IBM25PPC970FX6UB186ET
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 64-Bit, 1600MHz, CMOS, CBGA576, 25 X 25 MM, 1 MM PITCH, CERAMIC, BGA-576]
分类和应用: 时钟外围集成电路
文件页数/大小: 78 页 / 3525 K
品牌: IBM [ IBM ]
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Datasheet  
PowerPC 970FX RISC Microprocessor  
Revision  
Modification  
Version 1.0  
Updated features listing, Table 1-1. PPC 970FX Ordering and PVR for the Leaded Package Version and  
Figure 1-2 Part Number Legend.  
Added errata list and application note documents to Related Publications.  
Updated some of the specifications in Table 3-2. Recommended Operating Conditions.  
Updated Section 3.1.5 Power Consumption, modifying the content and form of the specification tables.  
Added a note to Figure 3-3. Block Diagram of an SSB for a Processor Interconnect Implementation.  
Updated some of the specifications in Section 3.5.1.2 Drive Side Characteristics.  
Extensively updated specifications in Table 3-6. Power Consumption for Power-Optimized Parts and  
Table 3-7. Power Consumption for Standard Parts.  
Updated some of the specifications in Table 3-11. Processor Interconnect SSB Driver Specifications and  
Table 3-13. Processor Interconnect SSB Receiver Specifications.  
Made major modifications to Table 3-12. Processor Interconnect SSB PCB Trace Specifications, Table 3-  
14. Processor Interconnect SSB Timing Parameters for the Deskew and Clock Alignment and Section  
3.5.1.4 Receive Side Characteristics.  
July 15, 2005  
Added Table 3-17. Input ac Timing Specifications for TBEN.  
2
Added a clarifying note to Section 3.10.1 I C Bus Timing Information.  
2
Clarified text in Section 3.10.3 I C and JTAG Considerations.  
Updated some of the specifications in Figure 3-10. JTAG Clock Input Timing Diagram.  
Made major modifications to Section 3.10.3 I2C and JTAG Considerations, Section 5.7.1 Thermal Man-  
agement pins, and Section 5.7.2 Reading Thermal Diode Calibration Data Through JTAG.  
Updated Section 4. PowerPC 970FX Microprocessor Dimension and Physical Signal Assignments to  
describe both packaging types.  
Changed the titles for Figure 4-1. PPC 970FX Microprocessor for Mechanical Package, Leaded, for DD3.0x  
Parts (top and side) and Figure 4-2. PPC 970FX Microprocessor Mechanical Package, Leaded, for DD3.1x  
Parts (top and side).  
Updated Table 5-2. PowerPC 970FX PLL Configuration and Table 5-3. System Configuration - Typical  
Examples of Pin Settings.  
Added Table 5-9. Thermal Diode Data Encoding.  
Updated some of the specifications in Table 5-10. Allowable Forces on the PowerPC 970FX Package.  
Revision Log  
Version 2.5  
March 26, 2007  
Page 10 of 78