PowerPC 740 and PowerPC 750 Microprocessor
CMOS 0.20 µm Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2
PowerPC 740 Package
Package Type
Package outline
Interconnects
Ceramic Ball Grid Array (CBGA)
21 x 21mm
255 (16 x 16 ball array - 1)
1.27mm (50mil)
2.45mm
Pitch
Minimum module height
Maximum module height
Ball diameter
3.00mm
0.89mm (35mil)
9/6/2002
Version 2.0
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