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IBM25PPC750L-GB350D2R 参数 Datasheet PDF下载

IBM25PPC750L-GB350D2R图片预览
型号: IBM25PPC750L-GB350D2R
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文件页数/大小: 54 页 / 1135 K
品牌: IBM [ IBM ]
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PowerPC 740 and PowerPC 750 Microprocessor  
CMOS 0.20 µm Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2  
Table of Contents  
Preface ..................................................................................................................................................... 5  
New Features for dd3.x ............................................................................................................................ 5  
Overview................................................................................................................................................... 6  
Features ................................................................................................................................................... 7  
General Parameters ................................................................................................................................. 9  
Electrical and Thermal Characteristics................................................................................................... 10  
DC Electrical Characteristics ..............................................................................................................10  
AC Electrical Characteristics .................................................................................................................. 14  
Clock AC Specifications ......................................................................................................................14  
Spread Spectrum Clock Generator (SSCG) .......................................................................................15  
60x Bus Input AC Specifications .........................................................................................................16  
60x Bus Output AC Specifications ......................................................................................................18  
L2 Clock AC Specifications .................................................................................................................20  
L2 Bus Input AC Specifications ...........................................................................................................22  
L2 Bus Output AC Specifications ........................................................................................................23  
IEEE 1149.1 AC Timing Specifications .................................................................................................. 25  
PowerPC 740 Microprocessor Pin Assignments.................................................................................... 27  
PowerPC 740 Package .......................................................................................................................... 30  
Mechanical Dimensions of the PowerPC 740 255 CBGA Package ....................................................31  
PowerPC 750 Microprocessor Pin Assignments.................................................................................... 32  
PowerPC 750 Package .......................................................................................................................... 35  
Mechanical Dimensions of the PowerPC 750 360 CBGA Package ....................................................36  
System Design Information .................................................................................................................... 38  
PLL Power Supply Filtering .................................................................................................................41  
Decoupling Recommendations ...........................................................................................................41  
Connection Recommendations ...........................................................................................................41  
Output Buffer DC Impedance ..............................................................................................................42  
Pull-up Resistor Requirements ...........................................................................................................43  
Thermal Management Information ......................................................................................................45  
Internal Package Conduction Resistance ...........................................................................................46  
Heat Sink Selection Example ..............................................................................................................48  
Ordering Information............................................................................................................................... 51  
09/06/2002  
Version 2.0  
Page 3