PowerPC 740 and PowerPC 750 Microprocessor
CMOS 0.20 µm Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2
Recommended Operating Conditions
Characteristic
Symbol
VDD
Value
See Note 2
VDD
Unit
V
Notes
Core supply voltage
1, 2
1
PLL supply voltage
AVDD
V
L2DLL supply voltage
L2AVDD
OVDD(3.3V)
OVDD(2.5V)
OVDD(1.8V)
L2OVDD(3.3V)
L2OVDD(2.5V)
L2OVDD(1.8V)
VIN(60X)
VDD
V
1
60x bus supply voltage, pin W1 tied high
60x bus supply voltage pin W1 tied to HRESET
60x bus supply voltage, pin W1 tied to GND
L2 bus supply voltage, pin A19 tied high
L2 bus supply voltage, pin A19 tied to HRESET
L2 bus supply voltage, pin A19 tied to GND
3.135 to 3.465
2.375 to 2.625
1.71 to 1.89
3.135 to 3.465
2.375 to 2.625
1.71 to 1.89
GND to OVDD
GND to L2OVDD
-40 to 105
V
1
V
1
V
1
V
1
V
1
V
1
Input voltage (Under AC conditions, inputs must go rail-to-
rail for maximum AC timing performance.)
V
1
VIN(L2)
V
1
Die-junction temperature
TJ
°C
1, 2
Note:
1. These are recommended and tested operating conditions. Proper device operation outside of these conditions is not guaranteed.
2. VDD and TJ are specified by the Application Conditions designator in the part number. See the Part Number Key on page 51 for more information.
Package Thermal Characteristics1
Characteristic
Symbol
740
750
Unit
Thermal resistance, junction-to-case (top surface
of die) typical
θJC
0.03
0.03
°C/W
2
2
Thermal resistance, junction-to-balls, typical
θJB
°C/W
3.8 - 7.1
16.0
3.8 - 7.6
Thermal resistance, junction-to-ambient, at air-
flow, no heat sink, typical
50 FPM
100 FPM
150 FPM
200 FPM
15.1
°C/W
°C/W
°C/W
°C/W
15.4
16.4
14.9
14.2
14.4
13.7
2
Package Size
Die Size
Note:
21 x 21
25 x 25
mm
2
5.12 x 7.78
5.12 x 7.78
mm
1. Refer to Section “Thermal Management Information,” on page 45 for more information about thermal management.
2. 3.8°C/W is the theoretical θ mounted to infinite heat sink. The larger number applies to a module mounted on a 1.8 mm thick, 2P card using 1 oz cop-
per power/gnd planes, with JaBn effective area for heat transfer of 75mm x 75mm.
The 750 incorporates a thermal management assist unit (TAU) composed of a thermal sensor, digital-to-ana-
log converter, comparator, control logic, and dedicated special-purpose registers (SPRs). See the PowerPC
740 and PowerPC 750 User’s Manual for more information on the use of this feature. Specifications for the
thermal sensor portion of the TAU are found in the table below.
Page 11
Version 2.0
9/6/2002
IBM [ IBM ]
