PowerPC 750 SCM RISC Microprocessor
PID8p-750
Preliminary Copy
PowerPC PID8p-750 Microprocessor Pin Assignments
The following sections contain the pinout diagrams for the PID8p-750 SCM. IBM offers a ceramic ball grid
array 360 CBGA packages.
Figure 13 (in part A) shows the pinout of the 360 CBGA package as viewed from the top surface. Part B
shows the side profile of the 360 CBGA package to indicate the direction of the top surface view.
Figure 13. Pinout of the 360 CBGA Package as Viewed from the Top Surface
17
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16
18 19
Part A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
Part B
W
Not to Scale
View
Substrate Assembly.
Encapsulation
Die
9/30/99
Version 2.0
Datasheet
Page 23
IBM [ IBM ]
