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IBM25PPC750L-EB0C366W 参数 Datasheet PDF下载

IBM25PPC750L-EB0C366W图片预览
型号: IBM25PPC750L-EB0C366W
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360]
分类和应用: 时钟外围集成电路
文件页数/大小: 46 页 / 610 K
品牌: IBM [ IBM ]
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PowerPC 750 SCM RISC Microprocessor  
PID8p-750  
Preliminary Copy  
PowerPC PID8p-750 Microprocessor Pin Assignments  
The following sections contain the pinout diagrams for the PID8p-750 SCM. IBM offers a ceramic ball grid  
array 360 CBGA packages.  
Figure 13 (in part A) shows the pinout of the 360 CBGA package as viewed from the top surface. Part B  
shows the side profile of the 360 CBGA package to indicate the direction of the top surface view.  
Figure 13. Pinout of the 360 CBGA Package as Viewed from the Top Surface  
17  
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16  
18 19  
Part A  
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
Part B  
W
Not to Scale  
View  
Substrate Assembly.  
Encapsulation  
Die  
9/30/99  
Version 2.0  
Datasheet  
Page 23  
 
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