Preliminary
PowerPC 750FL RISC Microprocessor
5.8.7 Thermal Interface and Adhesive Vendors
The board designer can choose between several types of thermal interfaces. Heat sink adhesive materials
must be selected based upon high conductivity and adequate mechanical strength to meet equipment
shock/vibration requirements. A partial list of vendors that advertise thermal interface materials for PowerPC
devices is shown in Table 5-9.
Table 5-9. 750FL Microprocessor Thermal Interface and Adhesive Materials Vendors
Company Names and Addresses for Thermal Interfaces and Adhesive Materials Vendors
Dow-Corning Corporation
Dow-Corning Electronic Materials
P.O. Box 0997
Midland, MI 48686-0997
(989) 496-4000
http://www.dowcorning.com/content/etronics
Chomerics, Inc.
77 Dragon Court
Woburn, MA 01888-4850
(781) 935-4850
http://www.chomerics.com
Laird Technologies
4797 Detroit Avenue
Cleveland, OH 44102-2216
(216) 939-2300 / (888) 246-9050
http://www.lairdtech.com
Henkel Corp - Industrial
1001 Trout Brook Crossing
Rocky Hill, CT 06067
(860) 571-5100 / (800) 562-8483
http://www.loctite.com/int_henkel/loctite_us/index.cfm
AI Technology
70 Washington Road
Princeton, NJ 08550-1097
(609) 799-9388
http://www.aitechnology.com
750flds60.fm.6.0
April 27, 2007
System Design Information
Page 63 of 65
IBM [ IBM ]
