DD 2.X
PowerPC 750FX RISC Microprocessor
Preliminary
5.8.7 Thermal Interface and Adhesive Vendors
The board designer can choose between several types of thermal interfaces. Heat sink adhesive materials
should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. A partial list of vendors that advertise thermal interface materials for PowerPC
devices is shown in Table 5-9 on page 56.
Table 5-9. 750FX Thermal Interface and Adhesive Materials Vendors
Company Names and Addresses for Thermal Interfaces and Adhesive Materials Vendors
Dow-Corning Corporation
Dow-Corning Electronic Materials
P.O. Box 0997
Midland, MI 48686-0997
(989) 496-4000
http://www.dowcorning.com/content/etronics
Chomerics, Inc.
77 Dragon Court
Woburn, MA 01888-4850
(781) 935-4850
http://www.chomerics.com
Thermagon, Inc.
4797 Detroit Avenue
Cleveland, OH 44102-2216
(216) 939-2300 / (888) 246-9050
http://www.Thermagon.com
Loctite Corporation
1001 Trout Brook Crossing
Rocky Hill, CT 06067
(860) 571-5100 / (800) 562-8483
http://www.loctite.com
AI Technology
70 Washington Road
Princeton, NJ 08550-1097
(609) 799-9388
http://www.aitechnology.com
5. System Design Information
Page 56 of 63
Body_750FX_DS_DD2.X.fm.2.0
June 9, 2003
IBM [ IBM ]
