DD 2.X
Preliminary
PowerPC 750FX RISC Microprocessor
Table 5-5 summarizes the driver impedance characteristics a designer uses to design a typical process.
Table 5-5. Driver Impedance Characteristics
Process
Worst
Typical
Best
60x Impedance (Ω)
OV (V)
Temperature (°C)
DD
50
44
36
50
44
36
65
50
35
1.70
1.80
1.90
238
105
65
0
Worst
Typical
Best
105
65
0
2.50
2.63
3.14
3.30
3.46
Worst
Typical
Best
105
65
0
5.4.1 Input-Output Usage
Table 5-6 Input-Output Usage provides details on the input-output usage of the PowerPC 750FX RISC Micro-
processor signals. The Usage Group column refers to the general functional category of the signal.
In the PowerPC 750FX RISC Microprocessor, certain input-output signals have pullups and pulldowns, which
may or may not be enabled. In Table 5-6, the Input/Output with Internal Resistors column defines which
signals have these pullups or pulldowns and their active or inactive state. The Level Protect column defines
which signals have the designated function added to their Input/Output cell. For more about Level Protection,
see Section 5.5 Level Protection on page 48.
Caution: This section is based on preliminary information and is subject to change.
Pull L2_TSTCLK and LSSD_MODE high for normal operation.
Pins shown as No Connect (NC) must not be connected.
Connect all GND pins to ground. Connect all V and OV pins to the appropriate supply.
DD
DD
Body_750FX_DS_DD2.X.fm.2.0
June 9, 2003
5. System Design Information
Page 43 of 63
IBM [ IBM ]
