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IBM25PPC750CXEJQ5512T 参数 Datasheet PDF下载

IBM25PPC750CXEJQ5512T图片预览
型号: IBM25PPC750CXEJQ5512T
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 533MHz, CMOS, PBGA256, 27 X 27 MM, LEAD FREE, PLASTIC, BGA-256]
分类和应用: 时钟外围集成电路
文件页数/大小: 44 页 / 416 K
品牌: IBM [ IBM ]
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Data Sheet  
Preliminary  
PowerPC® 750CXe RISC Microprocessor  
Table of Contents  
List of Tables ................................................................................................................. iii  
List of Figures ................................................................................................................ v  
1. General Information .................................................................................................... 1  
1.1 Features ........................................................................................................................................... 1  
1.2 Special Design Level Considerations/Features ........................................................................... 3  
1.3 Ordering Information ...................................................................................................................... 3  
1.4 Processor Version Register (PVR) ................................................................................................ 4  
2. Overview ...................................................................................................................... 5  
2.1 PowerPC 750CXe Block Diagram .................................................................................................. 5  
3. General Parameters .................................................................................................... 6  
4. Electrical and Thermal Characteristics ..................................................................... 7  
4.1 DC Electrical Characteristics ......................................................................................................... 7  
4.2 AC Electrical Characteristics ....................................................................................................... 10  
4.2.1 Clock AC Specifications ........................................................................................................ 10  
4.3 Spread Spectrum Clock Generator (SSCG) ................................................................................ 11  
4.4 60x Bus Input AC Specifications ................................................................................................. 12  
4.5 60x Bus Output AC Specifications .............................................................................................. 13  
4.5.1 IEEE 1149.1 AC Timing Specifications ................................................................................. 16  
5. PowerPC 750CXe Dimension and Physical Signal Assignments ........................ 18  
6. System Design Information ..................................................................................... 26  
6.1 PLL Configuration ......................................................................................................................... 26  
6.2 PLL Power Supply Filtering ......................................................................................................... 27  
6.3 Decoupling Recommendations ................................................................................................... 27  
6.4 Connection Recommendations ................................................................................................... 28  
6.5 Output Buffer DC Impedance ....................................................................................................... 28  
6.5.1 Input-Output Usage ............................................................................................................... 29  
6.6 Thermal Management Information .............................................................................................. 32  
6.6.1 Thermal Assist Unit ............................................................................................................... 32  
6.6.2 Heat Sink Considerations ...................................................................................................... 32  
6.6.3 Internal Package Conduction Resistance .............................................................................. 33  
6.7 Operational and Design Considerations ..................................................................................... 33  
6.7.1 Level Protection ..................................................................................................................... 33  
6.7.2 64- or 32-Bit Data Bus Mode ................................................................................................. 34  
6.7.3 60x Bus Operation ................................................................................................................. 34  
6.7.4 DBWO/L2_TSTCLK ............................................................................................................... 34  
6.7.5 CHKSTP_OUT/CLKOUT ....................................................................................................... 34  
750cxe_TOC.fm.1.5  
April 8, 2004  
Page i of 36  
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