PowerPC 405GP Embedded Processor Data Sheet
35mm, 456-Ball E-PBGA Package
Reserved Area for Ejector Pin Mark x 4 TYP
Top View
Corner Shape is Chamferred or Rounded
Gold Gate Release
Corresponds to
A1 Ball Location
33.5 REF
17.5 TYP
C
Note: All dimensions are in mm.
C
0.20
0.20
A
C
0.25
35.0
0.35
C
31.75
Bottom View
AF
AD
AB
Y
1.27 TYP
AE
AC
AA
W
U
Mold
Compound
V
Thermal Balls
T
R
P
35.0±0.2
N
PCB
Substrate
M
K
L
J
H
G
E
F
D
C
B
A
19 21 23
B
1
3
5
7
9 11 13 15 17
25
26
0.6±0.1
8 10
6
12 14
16 18
4
22
2
20
24
2.49 REF
2.65 max
0.65 ± 0.05 SOLDERBALL x 456
s
s
s
B
0.30 C A
s
0.15
C
Page 15 of 60
6/20/03